Thermoplastic composition, preparation method and application thereof

A thermoplastic composition and thermoplastic resin technology, applied in the field of thermoplastic compositions, can solve the problems of insufficient product stability and poor processing performance, and achieve the effects of excellent mechanical properties and electroless plating performance, uniform thickness, and wide application prospects

Inactive Publication Date: 2013-02-06
邓文 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the deficiencies of the above-mentioned prior art, the purpose of the present invention is to provide a high-filling functional plastic and its preparation method and application, aiming at solving the problems of poor processability and insufficient product stability of the mixed system with high inorganic content currently used

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The thermoplastic composition comprises the following components according to weight percentage:

[0057] Thermoplastic resin PC 68%;

[0058] Laser Direct Patterning Additive (Molybdenum Copper Oxide) 13%;

[0059] High dielectric additive (copper calcium titanate) 8%;

[0060] Inorganic filler (graphite powder) 3%;

[0061] Rubber solubilizing polymer (acrylic modified silicone) 4%;

[0062] Surface modifier (vinyl triethoxysilane coupling agent) 3%;

[0063] Antioxidant 0.5%;

[0064] Other additives 0.5%.

[0065] The preparation method of described thermoplastic composition, comprises the following steps:

[0066] Add 68% by weight thermoplastic resin, 13% laser direct patterning additives such as PC / ABS, ABS, PBT, LCP, etc., 3% surface modifier and 4% solubilizer to blend in the extruder;

Embodiment 2

[0068] The thermoplastic composition comprises the following components according to weight percentage:

[0069] Thermoplastic resin PPO 72%;

[0070] Laser direct patterning additive (basic copper phosphate) 11%;

[0071] High dielectric additive (BaTiO3) 5%;

[0072]Inorganic filler (calcium oxide, zinc oxide, etc.) 4%;

[0073] Rubber solubilizing polymer (acrylic modified silicone) 4%;

[0074] Surface modifier (titanate coupling agent) 1%;

[0075] Antioxidant 0.5%

[0076] Other additives 2.5%;

[0077] The preparation method of described thermoplastic composition, comprises the following steps:

[0078] Premixing: 11% by weight laser direct patterning additive, 1% surface modifier; 4% solubilizer, etc. are first mixed into component 1. Molding: the above component 1 material and blank base material are mixed before injection molding, For example, PC / ABS, ABS, PBT, LCP, etc. are mixed according to the proportion, pumped and dried at about 200 degrees.

[0079] Th...

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PUM

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Abstract

The invention discloses a thermoplastic composition, a preparation method and an application thereof. The thermoplastic composition comprises 25-87% of a thermoplastic resin, 8%-35% of a laser direct pattern additive, 0.5%-10% of a high dielectric additive, 2-10% of an inorganic filler, 1-10% of a rubber solubilizing polymer, 1-10% of a surface modification agent and 0.1-0.5% of an antioxygen. The obtained thermoplastic composition is used in a laser direct pattern method and is good in dispersibility, excellent in mechanical property and chemical plating performance, good in plating performance and processing shaping performance, capable of achieving fine lines with sizes below 100 mu m, and wide in application prospects in the aspect of weak current circuits of communication devices such as notebook computers, portable computers, mobile phones and hand-held terminals, medical treatment, a radio frequency identification (RFID) technology, automobiles, sensors, connectors and the like.

Description

technical field [0001] The invention relates to a thermoplastic composition, in particular to a highly filling functional plastic and its preparation method and application. Background technique [0002] Currently, forming 3D lines using the Laser Direct Patterning (LDP) method is becoming more and more popular. In the LDP method, a laser beam is moved over the surface of the product to activate the plastic surface where conductive paths are to be placed. With the help of laser direct patterning + refined plating method, a conductive path width of 100 microns or less can be obtained. In addition, the spacing between conductive paths may also be 100 microns or less. As a result, space and weight are saved in end-use applications by this approach. Another advantage of laser direct patterning is its flexibility. If the circuit design is changed, it is only a matter of reprogramming the computer that controls the cutting laser. [0003] A special active catalyst is used in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08L83/04C08K13/02C08K3/08C08K3/32C08K3/30C08K3/24C08K3/00C08K5/134
Inventor 邓文杨虎刘可
Owner 邓文
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