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Prepreg, wiring board, and semiconductor device

A technology of prepregs and wiring boards, which is applied in the field of wiring boards, semiconductor devices, and prepregs. It can solve problems such as difficulty in forming microcircuits and difficulty in satisfying the adhesion of embedded conductor layers, and achieve connection Excellent reliability, excellent mounting reliability, and excellent adhesion

Inactive Publication Date: 2015-04-29
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet such demands, thinning of the prepreg constituting the wiring board has also been studied. However, when the prepreg is thinned, it is difficult to satisfy both embedding and adhesion to the conductor layer. , and it is difficult to form a fine circuit when the conductor is laminated on the prepreg

Method used

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  • Prepreg, wiring board, and semiconductor device
  • Prepreg, wiring board, and semiconductor device
  • Prepreg, wiring board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1）

[0173] 1. Preparation of the first epoxy resin composition

[0174] 30 parts by weight of naphthalene-modified cresol novolac epoxy resin (manufactured by DIC Corporation, HP-5000) as an epoxy resin, biphenyl aralkyl type phenolic resin as a phenol curing agent (manufactured by Meiwa Chemical Co., Ltd., MEH7851- 5H) 20 parts by weight of phenoxy resin (manufactured by jER Corporation, YX-8100BH30, 30% by weight of solid content) as a thermoplastic resin, with a solid content of 30 parts by weight, as an average particle size of silica nanoparticles of 1 to 100 nm 20 parts by weight of spherical silica (manufactured by TOKUYAMA Co., Ltd., NSS-5N) with a diameter of 75 nm, and 0.5 parts by weight of imidazole (manufactured by Shikoku Chemicals, Inc., Curezol 2E4MZ) as a curing agent were mixed and dissolved in methyl ethyl ketone, and the non-volatile content was adjusted to 45 parts by weight. %, the first epoxy resin composition was prepared.

[0175] 2. Preparation of the 2n...

Embodiment 2）

[0190] In the preparation of the first epoxy resin composition, instead of using biphenyl aralkyl type phenolic resin and Curezol 2E4MZ, 20 wt. and Curezol 1B2PZ (manufactured by Shikoku Chemical Industry Co., Ltd.) 0.3 parts by weight, except that it is the same as in Example 1.

Embodiment 3）

[0192] In the preparation of the first epoxy resin composition, instead of using a naphthalene-modified cresol novolak epoxy resin, 30 parts by weight of an anthracene-type epoxy resin (manufactured by jER, YX-8800) was used. Example 2 is the same.

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Abstract

An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.

Description

technical field [0001] The present invention relates to a prepreg, a wiring board, and a semiconductor device. [0002] this application claims priority based on Japanese Patent Application No. 2010-151259 for which it applied to Japan on July 1, 2010, and uses the content here. Background technique [0003] A wiring board (circuit board) is generally formed by impregnating a thermosetting resin into a glass fiber substrate or the like to obtain a prepreg, laminating several prepregs, heating and pressing. In addition, the prepreg is obtained by a method of impregnating a glass fiber base material having a thickness of about 50 to 200 μm in a thermosetting resin composition (varnish) or the like (for example, refer to Patent Document 1). [0004] In some cases, prepregs require embedding properties in gaps for embedding circuit wiring on one side, and require adhesion to conductor layers for forming circuits on the other side. However, in the prepreg obtained by the conven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/24B32B5/28B32B27/12H05K1/03
CPCB32B17/04C08J2363/00H05K1/0366H05K3/4602H05K3/4655H05K2201/0195H05K2201/0209H05K2201/029H05K2201/0358H05K2201/0129H01L2224/16227Y10T428/24355Y10T428/252Y10T428/2495C08J5/244C08J5/249B32B27/12H05K1/03C08J5/24B32B5/24C08K3/36C08J2300/22C08K2201/005C08K2201/011B32B19/02H05K1/02
Inventor 大东范行远藤忠相
Owner SUMITOMO BAKELITE CO LTD