Novel bulk molding compound and preparation method thereof

A slug molding compound and a new type of technology are applied in the field of new slug molding compound and its preparation, which can solve the problems of poor electrical properties, poor surface hardness and poor wear resistance of molded products, and achieve high surface hardness and excellent electrical properties. , the effect of high mechanical strength

Active Publication Date: 2013-03-20
WUXI CHUANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the disadvantages of the current unsaturated polyester resin bulk molding compound are: poor moisture resistance of the material, especially poor electrical properties in hot and humid environments; poor surface hardness and poor wear resistance of the molded product Fully meet the requirements of special products

Method used

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  • Novel bulk molding compound and preparation method thereof
  • Novel bulk molding compound and preparation method thereof
  • Novel bulk molding compound and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A preparation method for preparing a novel bulk molding compound, the novel bulk molding compound is produced through the following steps:

[0028] (1) Mixing: 100 parts of unsaturated polyester resin, 20 parts of epoxy resin, 40 parts of polystyrene powder, 2.5 parts of dicumyl peroxide, and 1.0 parts of boron trifluoride-amine complex , after measuring 30 parts of additives, mix at high speed for 10-20 minutes;

[0029] (2) Kneading and mixing: The liquid components mixed at high speed are added to a biaxial kneading device, and 140 parts of wollastonite, 150 parts of aluminum hydroxide, and 100 parts of glass fiber are added in sequence, kneading and mixing, and the mixing time is 10 to 20 minutes. ≤50℃;

[0030] (3) Extrusion preforming: using an extruder to make strips and wrapping them individually with plastic film;

[0031] (4) Packing: packed in special barrier bags after measurement.

[0032] The above raw material components are all measured by weight.

Embodiment 2

[0034] A preparation method for preparing a novel bulk molding compound, the novel bulk molding compound is produced through the following steps:

[0035] (1) Mixing: 100 parts of unsaturated polyester resin, 40 parts of epoxy resin, 40 parts of polystyrene powder, 2.5 parts of dicumyl peroxide, and 2.0 parts of boron trifluoride-amine complex , after measuring 30 parts of additives, mix at high speed for 10-20 minutes;

[0036] (2) Kneading and mixing: the high-speed mixed liquid components are added to a biaxial kneading device, and 150 parts of wollastonite, 160 parts of aluminum hydroxide, and 110 parts of glass fiber are added in sequence, kneading and mixing, and the mixing time is 10 to 20 minutes. ≤50℃;

[0037] (3) Extrusion preforming: using an extruder to make strips and wrapping them individually with plastic film;

[0038] (4) Packing: packed in special barrier bags after measurement.

[0039] The above raw material components are all measured by weight.

Embodiment 3

[0041] A preparation method for preparing a novel bulk molding compound, the novel bulk molding compound is produced through the following steps:

[0042] (1) Mixing: 100 parts of unsaturated polyester resin, 60 parts of epoxy resin, 40 parts of polystyrene powder, 2.5 parts of dicumyl peroxide, 3.0 parts of boron trifluoride-amine complex , after measuring 30 parts of additives, mix at high speed for 10-20 minutes;

[0043] (2) Kneading and mixing: The liquid components mixed at a high speed are added to a biaxial kneading device, and 170 parts of wollastonite, 170 parts of aluminum hydroxide, and 120 parts of glass fiber are added in sequence, kneading and mixing, and the mixing time is 10 to 20 minutes. ≤50℃;

[0044] (3) Extrusion preforming: using an extruder to make strips and wrapping them individually with plastic film;

[0045] (4) Packing: packed in special barrier bags after measurement.

[0046] The above raw material components are all measured by weight.

[0...

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PUM

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Abstract

The invention relates to a novel bulk molding compound composed of the raw materials of: 100 parts of unsaturated polyester resin, 20-100 parts of epoxy resin, 20-60 parts of a low shrinkage modifier, 1-5 parts of an initiator, 0.5-5 parts of a curing accelerator, 60-150 parts of a reinforcing material, 100-250 parts of a filling material, 100-250 parts of a flame retardant, and 30-80 parts of an auxiliary agent. The initiator is an organic peroxide compound. The curing accelerator is epoxy latent accelerator. The flame retardant is hydroxide, and the reinforcing material is glass fiber. The invention has the advantages that: with the bulk molding compound prepared with the method provided by the invention, a manufactured product has the advantages of high mechanical strength, high surface hardness, no halogen, environment friendliness, excellent electrical properties under harsh environments especially hot and humid environments, and the like.

Description

technical field [0001] The invention relates to a novel bulk molding compound and a preparation method thereof, in particular to a bulk molding compound containing epoxy resin and a preparation method thereof. Background technique [0002] Bulk molding compound is a soft dough-like thermosetting composite material made of liquid resin as the matrix resin. Among the main thermosetting resins such as unsaturated polyester resin, epoxy resin, and phenolic resin, unsaturated polyester resin is used in bulk molding. Molding compound is the most, that is, the bulk molding compound is usually unsaturated polyester resin bulk molding compound (referred to as BMC), which has a wide range of uses due to its low cost, good formability, good mechanical strength and electrical properties. [0003] However, the disadvantages of the current unsaturated polyester resin bulk molding compound are: poor moisture resistance of the material, especially poor electrical properties in hot and humid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/06C08L63/00C08L25/06C08K13/04C08K7/14C08K3/34C08K3/26C08K3/22
Inventor 陈火保
Owner WUXI CHUANGDA ELECTRONICS
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