Electroplating method of smart card package frame

A smart card and frame technology, applied in the field of electronic information, can solve the problem of high manufacturing cost, achieve good physical properties, ensure wear resistance and corrosion resistance, good corrosion resistance and wear resistance

Active Publication Date: 2013-03-20
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this process is that the manufacturing cost is high. The smart card frame is a three-layer layered structure, the innermost layer is a copper layer, the middle is a nickel layer, and the surface is a gold layer.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 1. Pretreatment: Ultrasonic oscillation and electrolytic degreasing are used to degrease the copper surface of the forming frame. Alkaline degreasing powder is used to prepare a solution with a concentration of 70g / L at a temperature of 55°C. The electrolytic degreasing current density is 10ASD; the immersion time is 18s;

[0047] 2. Activation: Activation treatment is performed on the copper surface after degreasing, using a mixed solution of 70g / L ZA-200 microetch agent and 3% sulfuric acid by mass fraction, and the immersion time is 12s at a temperature of 35°C;

[0048] 3. Nickel plating: 1.8~2μm thick nickel layer is electroplated on the contact layer of the forming frame, and 4 sub-slots are used for nickel plating. The electroplating liquid composition is 100g / L of nickel sulfamate, 13g / L of nickel chloride, and 38g / L of boric acid. L, nickel softener 4ml / L, nickel wetting agent 3ml / L. PH=3.8, the temperature is 55℃, the current density is controlled at 18ASD, a...

Embodiment 2

[0054] 1. Pretreatment: Ultrasonic oscillation and electrolytic degreasing are used to degrease the copper surface of the forming frame. Alkaline degreasing powder is used to prepare a solution with a concentration of 70g / L at a temperature of 55°C. The current density of electrolytic degreasing is 12ASD; the immersion time is 18s;

[0055] 2. Activation: Activation treatment is performed on the copper surface after degreasing, using a mixture of 75g / L ZA-200 microetch agent and 2% sulfuric acid, and the immersion time is 12s at a temperature of 32°C;

[0056] 3. Nickel plating: Electroplate a nickel layer with a thickness of 2~2.2μm on the contact layer of the forming frame. Four sub-slots are used for nickel plating. The electroplating potion is composed of nickel sulfamate 100g / L, nickel chloride 13g / L, and boric acid 38g / L, nickel softener 4ml / L, nickel wetting agent 3ml / L. PH=3.8, the temperature is 55℃, the current density is controlled at 20ASD, and the immersion time...

Embodiment 3

[0062] 1. Pretreatment: Ultrasonic vibration and electrolytic degreasing are used to degrease the copper surface of the forming frame. Alkaline degreasing powder is used to prepare a solution with a concentration of 75g / L. The optimal temperature is 55°C. The optimum current density for removing oil is 10ASD; the immersion time is 18s;

[0063] 2. Activation: Activation treatment is performed on the copper surface after degreasing, using a mixture of 75g / L ZA-200 microetch agent and 4% sulfuric acid, and the immersion time is 12s at a temperature of 30°C;

[0064] 3. Nickel plating: Electroplate a nickel layer with a thickness of 2~2.2μm on the contact layer of the substrate frame, and use 4 sub-slots for nickel plating. The electroplating potion is composed of nickel sulfamate 100g / L, nickel chloride 13g / L, boric acid 38g / L, nickel softener 4ml / L, nickel wetting agent 3ml / L. PH=3.8, the temperature is 55℃, the current density is controlled at 20ASD, and the immersion time is...

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Abstract

The invention provides an electroplating method of a smart card package frame and belongs to the technical field of electronic information. The electroplating method is characterized by comprising the following steps of: electroplating a nickel layer which is 1.8-2.2 microns thick on the contact layer of the frame after performing pretreatment on the molded frame, and then electroplating a phosphorus-nickel alloy layer which is 0.4-0.8 microns thick on the basis of the nickel layer, and further electroplating a gold layer which is 0.009-0.05 microns thick outside the phosphorus-nickel alloy layer of the contact surface of the frame. The electroplating method provided by the invention can be used for improving the wearability and corrosion resistance of the contact surface of the product. Besides, the electroplating method is also capable of reducing the thickness of the hard metal, omitting the application of posttreatment and greatly saving the cost.

Description

technical field [0001] The invention discloses an electroplating method for a smart card packaging frame, which belongs to the field of electronic information technology. Background technique [0002] Smart card is also called IC card (Integrated Circuit Card, integrated circuit card), smart card (intelligent card), microcircuit card (microcircuit card) or microchip card, etc. It is to embed a microelectronic chip in the card base conforming to the ISO7816 standard and make it into a card form. Smart card is another new type of information tool after magnetic card. Common smart cards use radio frequency technology to communicate with card readers. It successfully solves the problem of passive (no power supply in the card) and contact-free, which is a major breakthrough in the field of electronic devices. It is mainly used in the automatic toll collection system of buses, ferries, and subways, and is also used in access control management, identity verification, and electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/12C25D5/34
Inventor 何玉凤王亚斌刘琪卞京明
Owner 新恒汇电子股份有限公司
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