Polyimide film and method for preparing two-layer flexible copper clad laminate using the same

A technology of polyimide film and polyimide, which is applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve problems such as difficult to realize double-sided flexible copper-clad laminate manufacturing, and achieve excellent dimensional stability sexual effect

Active Publication Date: 2014-10-08
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the process of preparing 2L-FCCL by coating method is difficult to realize the manufacture of double-sided flexible copper clad laminates, and the process of lamination method can solve this problem

Method used

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  • Polyimide film and method for preparing two-layer flexible copper clad laminate using the same

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015]The reactor with reflux was filled with nitrogen, and 0.33mol of 3-phenyl-2,6-bis(4-aminophenyl)pyridine, 0.19mol of bis(4-aminophenyl)-4-(tribromo Methyl)phenylphosphine oxide, 0.48mol of 4,4'-methylenebis(2-tert-butylaniline), the reaction temperature was raised to 45°C, and then stirred at constant temperature for 30min to dissolve all diamine monomers in In N-methylpyrrolidone, after completely dissolving, lower the reaction temperature to 19°C, then add 0.70mol of 3,3-phenylene sulfide-4,4',5,5'- Biphenyltetracarboxylic dianhydride and 0.33 mol of pyromellitic dianhydride. After the addition of the dianhydride monomer, the reaction was carried out at a constant temperature for 6 hours to obtain a polyamic acid copolymer solution. The polyamic acid copolymer solution was adjusted to 13% with N-methylpyrrolidone, and then the solution was coated on a glass plate to control the thickness of the coating film at 0.017mm, and the coated glass plate was placed in a vacuum...

Embodiment 2

[0018] After the reactor with reflux is filled with nitrogen, add 0.47mol of 3-phenyl-2,6-bis(4-aminophenyl)pyridine, 0.19mol of bis(4-aminophenyl)-4-(tri Bromomethyl) phenylphosphine oxide, 0.21mol of 4,4'-methylenebis(2-tert-butylaniline) and 0.13mol of 4,4'-diaminodiphenyl ether, the reaction temperature was raised to 45 ℃, and then stirred at constant temperature for 30 minutes to dissolve all diamine monomers in N,N-dimethylacetamide. After complete dissolution, the reaction temperature was lowered to 20 ℃, and then 0.70mol was added in 5 times at intervals of 12 minutes. 3,3-phenylene sulfide-4,4',5,5'-biphenyltetracarboxylic dianhydride and 0.33mol of pyromellitic dianhydride. After the addition of the dianhydride monomer, the reaction was carried out at a constant temperature for 6 hours to obtain a polyamic acid copolymer solution. The solid content of this polyamic acid copolymer solution is adjusted to 10% with N,N-dimethylacetamide, then the solution is coated on ...

Embodiment 3

[0021] The reactor with reflux was filled with nitrogen, and 0.29mol of 3-phenyl-2,6-bis(4-aminophenyl)pyridine, 0.42mol of bis(4-aminophenyl)-4-(tribromo Methyl)phenylphosphine oxide, 0.29mol of 4,4'-methylenebis(2-tert-butylaniline), the reaction temperature was raised to 45°C, and then stirred at constant temperature for 30min to dissolve all diamine monomers in In N-methylpyrrolidone, after completely dissolving, lower the reaction temperature to 10°C, then add 0.23mol of 3,3-phenylenesulfide-4,4',5,5'- Biphenyltetracarboxylic dianhydride, 0.33 mol of pyromellitic dianhydride and 0.49 mol of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride. After the addition of the dianhydride monomer, the reaction was carried out at a constant temperature for 12 hours to obtain a polyamic acid copolymer solution. The solid content of this polyamic acid copolymer solution is adjusted to 13% with N-methylpyrrolidone, then the solution is coated on a glass plate, and the thickness of t...

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Abstract

The invention relates to thermoplastic polyimide (TPI) film with low coefficient of thermal expansion, a preparation method of the TPI film, and a method for preparing a double-layer flexible copper-clad plate (2L-FCCL) by utilizing the TPI film. The preparation method of the TPI film comprises the following steps in sequence: polymerizing bi(4-aminobenzene)-4-(tribromomethyl) phenylphosphine and 3-phenyl-2, 6-bi(4-aminobenzene) pyridine on a certain mole ratio with relative diamine and dianhydride in form of solution, so as to obtain a polyamide acid copolymer; drying to remove the solvent; and carrying out thermal imidization to process the copolymer, thus obtaining the TPI film which is excellent in hot melting performance and dimensional stability. According to the method for preparing the double-layer flexible copper-clad plate by the TPI film, the TPI film is compounded with a thermoset polyimide film and a copper foil under a certain pressure and temperature, thus obtaining the double-layer flexible copper-clad plate which is excellent in comprehensive performances, such as stripping quality and dimensional stability.

Description

technical field [0001] The invention relates to the field of preparing thermoplastic polyimide materials with good hot-melt processing performance and low thermal expansion coefficient, and a method for preparing flexible polyimide copper-clad boards by using thermoplastic polyimide materials. technical background [0002] Polyimide (PI) film is one of the basic materials commonly used in the flexible copper clad laminate industry. Compared with the other two insulating substrates polyester film and polynaphthalene film commonly used in flexible copper clad laminates, polyimide film has high strength. , Good toughness, superior heat resistance and other characteristics, especially its superior heat resistance, can withstand high temperature of 500 ℃ in a short time, and can be used for a long time below 300 ℃. However, while polyimide has excellent properties, it also has the disadvantage of being difficult to be hot-melt processed. Thermoplastic polyimide (TPI) is a type o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18B32B15/08B32B15/20
Inventor 徐勇
Owner NANJING UNIV OF SCI & TECH
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