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2results about How to "Improve other properties" patented technology

A method for preparing electronic-grade hydrofluoric acid

ActiveCN118598080Breduce usageRealize secondary useHydrogen fluorideDistillationThiol group
This invention relates to a method for preparing electronic-grade hydrofluoric acid. The invention utilizes a microchannel reactor for the fluorine oxidation reaction, significantly reducing fluorine consumption and safety hazards during production. Furthermore, the microchannel reactor enhances the gas-liquid two-phase mass transfer during the oxidation reaction, further improving impurity removal and product quality. The addition of multi-effect distillation to the distillation process not only enables secondary heat utilization but also saves on the use of high-temperature heating media at the bottom of the column, effectively reducing energy consumption. In the modified liquid, DMF serves as the solvent, cobalt nitrate provides cobalt ions, and vinylguanidine provides guanidine functional groups and amino groups. Ammonia and propanethiol are used as plasma gases to introduce amino and thiol groups onto the membrane surface. These groups help improve membrane selectivity, effectively separating metal and non-metal ions, as well as acidic impurities in the raw materials.
Owner:TIANJIN UNIV +2

A coating solution for preparing high-temperature resistant and high-thermal-conductivity epoxy-based conductive thin films, its preparation method, and its application.

This invention discloses a coating solution for preparing high-temperature resistant and high-thermal-conductivity epoxy-based conductive films, its preparation method, and its application. By weight, it comprises the following raw material components: 70-85 parts liquid epoxy resin, 15-30 parts solid epoxy resin, 5-35 parts latent curing agent, 0.5-5 parts accelerator, 300-600 parts conductive filler, 15-30 parts thermoplastic resin, 0.5-2 parts coupling agent, and 30-60 parts solvent. The thermoplastic resin is a phenoxy resin with a special chemical structure and a molecular weight of 20,000-65,000 g / mol. This invention, by introducing a high-temperature resistant thermoplastic resin into the coating solution formulation, enables the prepared conductive film product to possess excellent comprehensive properties such as toughness, adhesion characteristics, and high-temperature stability.
Owner:CHINA BLUESTAR CHENGRAND CO LTD +1