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Preparation method of copolymerization polyimide and cover film with copolymerization polyimide

A technology of polyimide film and polyimide, which is applied in the direction of film/sheet adhesives, printed circuit components, adhesives, etc., and can solve the problem of polyimide film wrinkle dimensional stability, punching property Difficult, unfavorable processing and other problems, to achieve the effect of good dimensional stability, excellent production quality, and improved rotation

Inactive Publication Date: 2013-04-17
KUSN APLUS TEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the production of polyimide films mostly adopts biaxially stretched films or uniaxially stretched films. The biaxially stretched or process modification measures are used to improve appearance and dimensional stability; the general uniaxially stretched film process The above property requirements cannot be met; however, due to factors such as whether the winding technology and post-processing conditions are optimized and the storage period of the finished product, the polyimide film still has wrinkles and poor dimensional stability.
Therefore, the application of polyimide film (PoIyimide film; PI for short) in the flexible circuit board cover film is not conducive to processing due to the punchability (Punch) of the material product.

Method used

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  • Preparation method of copolymerization polyimide and cover film with copolymerization polyimide
  • Preparation method of copolymerization polyimide and cover film with copolymerization polyimide
  • Preparation method of copolymerization polyimide and cover film with copolymerization polyimide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1: Add 1 mole of No. 2 diamine monomer into N, N dimethylacetamide (DMAc) solvent, and then add 1 mole of No. 2 dianhydride monomer into DMAc solvent to dissolve after completely dissolving. Copolymerization was carried out at room temperature for 8 hours. This copolymerization reaction obtains the aromatic copolymerization polyamic acid (Polyamic Acid; PAA) solution of solid content about 15~35%, then further adds acetic anhydride and trace catalyst tertiary amine (beta-picoline and pyridine) mixed and stirred evenly, then let it stand for defoaming, then evenly coated with a suitable scraper at the end of the coating machine, pulled out to form a film, entered the oven section and baked step by step in the temperature program stage (180°C → 260°C → 400°C) film forming.

[0036] From the above chemical cyclization reaction, the molar ratio of No. 1 diamine monomer: No. 2 diamine monomer: No. 1 dianhydride monomer: No. 2 dianhydride monomer = 0: 100: 0: 100 is ...

Embodiment 2

[0038]Example 2: After adding 0.005 mole No. 1 diamine monomer into N, N dimethylacetamide (DMAc) solvent for dissolution, then add 0.095 mole No. 2 diamine monomer into DMAc solvent until completely dissolved Then, 0.10 mole No. 2 dianhydride monomer was added into DMAc solvent to dissolve, and the copolymerization reaction was carried out at room temperature for 8 hours. This copolymerization reaction produces an aromatic copolymerized polyamic acid (PAA) solution with a solid content of about 15-35%, and then further adds acetic anhydride and a small amount of catalyst tertiary amine (beta-picoline and pyridine) to the PAA solution and mixes it Evenly, then stand for defoaming, then use a suitable scraper on the end of the coating machine to evenly coat and pull out to form a film, enter the oven section and bake step by step in the stage of temperature program (180°C → 260°C → 400°C) to form a film.

[0039] From the above chemical cyclization reaction, it can be obtained ...

Embodiment 3

[0041] Example 3: Add 0.02 mole No. 1 diamine monomer in DMAc solvent to dissolve, then add 0.08 mole No. 2 diamine monomer in DMAc solvent, and then add 0.01 mole No. 1 dianhydride monomer after completely dissolving In DMAc solvent, after completely dissolving, add 0.09 mole No. 2 dianhydride monomer to dissolve in DMAc solvent, and carry out copolymerization reaction at room temperature for 8 hours. This copolymerization reaction produces an aromatic copolymerized polyamic acid (PAA) solution with a solid content of about 15-35%, and then further adds acetic anhydride and a small amount of catalyst tertiary amine (beta-picoline and pyridine) to the PAA solution and mixes it Evenly, then stand for defoaming, then use a suitable scraper on the end of the coating machine to evenly coat and pull out to form a film, enter the oven section and bake step by step in the stage of temperature program (180°C → 260°C → 400°C) to form a film.

[0042] From the above chemical cyclization...

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Abstract

The invention discloses a preparation method of copolymerization polyimide and a cover film with the copolymerization polyimide. The preparation method comprises the steps of synthesizing a novel aromatic co-polymerized polyamide acid through copolymerization of two diamine monomers and two dianhydride monomers according to a proportion in an organic solvent by changing the structures of molecular chains thereof; then cyclizing to produce heat-resistant co-polymerized polyimide with excellent high functions, and making the co-polymerized polyimide into a film by using an uniaxial stretching apparatus. The co-polymerized polyimide film can be used as the cover film for a printed circuit board. The printed circuit board co-polymerized polyimide film has excellent elastic modulus, low thermal expansion coefficient, good dimensional stability, low moisture absorption, high heat-resistant property, etc. Due to excellent physical properties, the co-polymerized polyimide film can be used for advanced electronic materials. For example, the co-polymerized polyimide film can be widely applied in soft printed circuit boards, IC semiconductors, IC packages and other relevant electrical material industries.

Description

technical field [0001] The invention relates to a preparation method of polyimide and a cover film for printed circuit board using the polyimide. Background technique [0002] With the development of miniaturization and high functionality of electronic products, highly functional polyimide films play an important role in materials. Polyimide film has excellent heat resistance and chemical resistance, mechanical properties and electrical properties, etc. Therefore, it is widely used in various industries such as electronics, electrical machinery, automobiles, aerospace and machinery. Polyimide film plays an important role in materials in the electronics industry, and is mainly used in the LCD liquid crystal display industry, IC semiconductor industry, and flexible circuit board industry. Among them, polyimide film form accounts for the largest proportion. [0003] At present, the production of polyimide films mostly adopts biaxially stretched films or uniaxially stretched f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08B29C55/04C09J7/02H05K1/02
Inventor 张孟浩李建辉
Owner KUSN APLUS TEC CORP
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