Method for manufacturing CEM (Composite Epoxy Material Grade)-3 copper-clad plate with high dielectric constant and low loss

A technology with high dielectric constant and manufacturing method, applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problems of high cost and complicated process, and achieve low cost, simple process, good heat resistance and The effect of mechanical strength

Active Publication Date: 2013-05-15
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polyimide resin-based copper clad laminates have high cost and complicated process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for manufacturing a high dielectric constant, low loss CEM-3 copper clad laminate, comprising the following steps:

[0021] 1. Preparation of epoxy resin solution:

[0022] 1.1 Dissolve 100 parts of epoxy resin with 40 parts of the first solvent to make an epoxy resin solution. The epoxy resin is bisphenol A epoxy, and the first solvent is butanone.

[0023] 1.2 Dissolve 4 parts of the curing agent with 10 parts of the second solvent to make a curing agent solution. The curing agent is 2-methyl-imidazole, and the second solvent is butanone.

[0024] 1.3 3 parts of hydroxyl inactivator, the hydroxyl inactivator is active silicone,

[0025] 1.4 Stir the epoxy resin solution, curing agent solution, and hydroxyl inactivator evenly to make an epoxy resin liquid, stir evenly, and wait for 8 hours of aging;

[0026] 2. Surface treatment of composite filler: mix 500 parts of high dielectric filler, 150 parts of third solvent, and 4 parts of surface treatment agent at...

Embodiment 2

[0032] A method for manufacturing a high dielectric constant, low loss CEM-3 copper clad laminate, comprising the following steps:

[0033] 1. Preparation of epoxy resin solution:

[0034] 1.1 Dissolve 100 parts of epoxy resin with 40 parts of the first solvent to make an epoxy resin solution. The epoxy resin is brominated bisphenol A epoxy, and the first solvent is butanone

[0035] 1.2 Dissolve 1.2 parts of curing agent with 20 parts of the second solvent to make a curing agent solution. The curing agent is dicyandiamide, and the second solvent is DMF.

[0036] 1.3 30 parts of hydroxyl inactivator, the hydroxyl inactivator is active silicone,

[0037] 1.4 Stir the epoxy resin solution, curing agent solution, and hydroxyl deactivator evenly to make epoxy resin liquid;

[0038] 2. Surface treatment of composite filler: 480 parts of high dielectric filler, 150 parts of the third solvent, 4 parts of surface treatment agent, mixed and stirred at 40 ° C for 2 hours,

[0039] Th...

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Abstract

The invention provides a method for manufacturing a CEM (Composite Epoxy Material Grade)-3 copper-clad plate with a high dielectric constant and low loss. The method for manufacturing the CEM-3 copper-clad plate with the high dielectric constant and the low loss comprises the following steps of: firstly, preparing epoxy resin liquid; carrying out surface treatment on composite fillers; preparing composite resin liquid; preparing a bonding sheet; and finally, pressing a lamination plate. The method provided by the invention uses bisphenol A epoxy resin with low cost, good manufacturability and good dielectric properties as main resin, and the problems of the cost and the manufacturability of a product can be solved; the high-dielectric fillers are partially composited by using a special curing agent, so that a curing article has a high dielectric constant, low loss, good thermal resistance, and high mechanical strength; and the CEM-3 copper-clad plate manufactured by the method disclosed by the invention has the advantages of simple process, low cost and good properties.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to a method for manufacturing a CEM-3 copper-clad laminate with high dielectric constant and low loss. Background technique [0002] With the rapid development of my country's Beidou satellite positioning system, it will reach global coverage in 2015. Various positioning systems, such as communication positioning, vehicle positioning, personal positioning, remote control mapping, navigation and other systems have been developed rapidly, prompting the continuous emergence of various positioning electronic products. In order to achieve its miniaturization, light weight and other goals, it is necessary to develop copper clad laminate products with high dielectric constant and low loss. [0003] The current high dielectric constant copper clad laminates are generally made of polytetrafluoroethylene resin, cyanate resin, or polyphenylene ether resin with high dielectric f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/092B32B27/04B32B27/20B32B27/26B32B37/10C08L63/02C08K13/06C08K9/06C08K3/22C08K3/24C08K7/14C08G59/50C08G59/40
Inventor 师剑英王金龙
Owner SHAANXI SHENGYI TECH
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