Organic-silicon pouring sealant composition with high thermal conductivity and application thereof

Abstract

The invention provides an organic-silicon pouring sealant composition with high thermal conductivity and an application thereof. The composition comprises a component A and a component B, wherein the component A comprises 100 parts of vinyl silicone oil, 6-14 parts of hydrogen silicone oil, 400-1000 parts of organic-silicon coated alumina powder and 0.1-0.8 part of inhibitor; and the component B comprises 100 parts of vinyl silicone oil, 400-1000 parts of organic-silicon coated alumina powder and 0.2-1.5 parts of catalyst. The composition can still achieve high alumina addition volume under the premise of ensuring low viscosity of the organic-silicon pouring sealant, thus improving the thermal conductivity of the pouring sealant.

Description

technical field [0001] The invention relates to a high thermal conductivity silicone potting adhesive composition and its application, in particular to a high thermal conductivity two-component silicone potting adhesive composition, which is especially suitable for potting applications in electronic appliances. Background technique [0002] Insulating thermally conductive silicone materials not only overcome the shortcomings of the traditional methods of solving the heat dissipation of electronic equipment, such as laying a layer of insulating medium between the heating element and the radiator as a thermally conductive material (such as mica, beryllium oxide ceramics, etc.). Poor performance, low mechanical properties, high price and other disadvantages, but also has good thermal conductivity, high and low temperature resistance, high elasticity, excellent insulation, and light weight, easy processing and excellent fatigue resistance, etc., for the improvement of electrical ...

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Problems solved by technology

[0010] The above-mentioned method of treating alumina organically can reduce the processing viscosity of organic silicon materials to a certain extent, and increase its addition amount in resin, but there are still the following deficiencies: (1) small molecular weight coupling agents, due to organic molecular chain segments Short, the coating effect on the surface of inorganic powder is limited; (2) The long chain of silicone is conducive to coating the surface of the powder, and has good compatibility with the resin, but it will also interact with the molecular chain segment of the resin Form entanglement between them, especially when the powder filling amount is large, to a certain extent, through the bridging effect of the powder particles, the resin molecular segments are physically cross-linked, thereby increasing the viscosity of the thermally conductive silicone mixture , affecting its construction process

The thermal conductivity of the obtained silicone material can be improved by increasing the filling amount of alumina powder, but this in turn will lead to an increase in the viscosity of the silicone mixture

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