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Target magnetron sputtering device and film coating method used for powder particle surface film coating

A technology for target magnetron sputtering and particle surface, applied in the field of powder particle surface coating technology, can solve the problems of inability to achieve co-sputtering, fixed coating thickness, difficult adjustment, etc., to improve efficiency, low operating cost, The effect of processing a large amount of powder

Inactive Publication Date: 2013-06-19
GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The coating thickness of this equipment is relatively fixed, it is difficult to adjust and only one target cannot achieve co-sputtering
Patent CN101805893A provides a horizontal-axis drum-type sample stage for magnetron sputtering, which includes an ultrasonic vibration mechanism and a screen, etc. Its coating is uniform and the coating thickness is easy to adjust, but its structure is relatively complicated, and it can only sputter coating in one direction

Method used

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  • Target magnetron sputtering device and film coating method used for powder particle surface film coating
  • Target magnetron sputtering device and film coating method used for powder particle surface film coating
  • Target magnetron sputtering device and film coating method used for powder particle surface film coating

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Effect test

Embodiment 1

[0034] Embodiment 1 is used for the target magnetron sputtering device of coating on the surface of powder particles

[0035] see figure 1 and figure 2 As shown, in a preferred embodiment of the present invention, the magnetron sputtering coating device includes a vacuum chamber 1, a roller 2 with openings at both ends, two support rollers 3 with limiting slopes, a motor and a speed regulating device 4 , two magnetron sputtering target frames 5 and a sputtering power supply 6 .

[0036] Wherein, the support rollers 3 are connected with the motor and the speed regulating device 4, and the two support rollers 3 are axially horizontal, parallel to each other and located at the same level. The axial length of the support roller 3 is 20cm, and the outer diameter d of the support roller 3 is 8cm, the inclination angle θ of the limiting slope of the support roller is 145°, and the width of the limiting slope of the supporting roller is b 1 It is 2cm.

[0037] The wall thickness...

Embodiment 2

[0040] Embodiment 2 Using the device described in Embodiment 1 to carry out magnetron sputtering copper alloy film on the surface of solid glass sphere powder particles

[0041] The process steps are as follows:

[0042] 1. Open the vacuum chamber, put 150 grams of solid glass ball powder particles with a particle size of 50 μm and 150 grams of glass grinding balls into the roller, place the roller on the supporting roller, and the diameter of the glass grinding balls is 4mm; put the required two copper The targets are respectively installed on the target frame, and the axis of the target is aligned with the axis of the roller;

[0043] 2. Close the vacuum chamber, open the vacuum pumping device, and pump the vacuum chamber to 0.5×10 -3 Pa;

[0044] 3. Fill the vacuum chamber with argon gas, and use a mass flow meter to control the flow rate to ensure that the working pressure of the vacuum chamber is 0.5Pa during sputtering;

[0045] 4. Turn on the motor, adjust the speed ...

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Abstract

The invention provides a target magnetron sputtering device and a film coating method used for powder particle surface film coating. The target magnetron sputtering device comprises a vacuum chamber, a roller with openings at two ends, two support rollers, a motor, a speed regulation device, two magnetron sputtering target frames and a sputtering power source, wherein each support roller is provided with a limiting inclined face. The support rollers are connected with the speed regulation device. The roller is directly placed on the support rollers and driven to rotate through the support rollers. Target materials are arranged at the positions of the openings at the two ends of the roller. During magnetron sputtering film coating, a grinding ball and powder are simultaneously placed into the roller, the rotating speed of the motor is regulated, the grinding ball and powder particles in the roller are enabled to drop in a parabola mode, sputtering stream injected from the openings of the roller is deposited on the falling powder, and film with good evenness is obtained after a certain period of time. The target magnetron sputtering device and the film coating method used for the powder particle surface film coating are large in technological handling capacity, low in operational cost and suitable for industrial production.

Description

technical field [0001] The invention relates to a powder particle surface coating process, in particular to a vacuum coating device and method suitable for dynamic magnetron sputtering coating. Background technique [0002] With the advancement of science and technology and the rapid development of the new material industry, people's requirements for powder performance are also continuously increasing. Treating the surface or interface of powder materials by physical, chemical, mechanical and other methods can improve or change the properties of powder materials to meet the needs of new materials, new processes and new technology development. Among them, surface coating technology is the most widely used powder surface treatment technology. [0003] The surface coating methods of powder particles mainly include electroless plating, electroplating, vacuum sputtering, vacuum evaporation, chemical vapor deposition and sol-gel method. Electroless plating, electroplating, sol-g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35
Inventor 曹瑞军林晨光林中坤
Owner GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS BEIJNG
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