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High-viscosity composite film for flexible electronic packaging application, and its processing method

A technology of electronic packaging and processing method, which is applied in the field of high-viscosity composite film for flexible electronic packaging applications and its processing, can solve the problems of low safety and immature technology, and achieves improved surface energy, good dimensional stability and performance. good effect

Active Publication Date: 2013-06-26
宜兴市王者塑封有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most electronics factories use electric irons in the process of pasting the cover film, which is immature and not safe.

Method used

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  • High-viscosity composite film for flexible electronic packaging application, and its processing method

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Embodiment Construction

[0016] like figure 1 As shown, the high-viscosity composite film for electronic applications of the present invention comprises a polyester film substrate layer 1, a first adhesive layer 2, an adhesion promoter layer 3, a second adhesive layer 4 and a heat-sealing layer 5 from the top layer to the bottom layer.

[0017] The processing method of this high-viscosity composite film comprises the following steps:

[0018] 1) Using polyester film as the substrate, using plasma chemical modification technology to improve the surface tension of polyester film;

[0019] 2) Coat a layer of polymer solution under the modified polyester film as an intermediate adhesive, and after drying, compound with the melt-modified polyolefin resin of the first casting technology to form an adhesion-promoting layer;

[0020] 3) After cooling and trimming on-line, another layer of polymer solution is coated under the adhesion-promoting layer as an intermediate adhesive, and after drying, it is c...

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Abstract

The invention discloses a high-viscosity composite film for flexible electronic packaging application, and its processing method. The composite film comprises, from top to bottom, a polyester film base layer, a first adhesive layer, an auxiliary adhesive layer, a second adhesive layer and a heat seal layer. The method comprises the following steps: improving the surface tension of a polyester film by treating the polyester film as a base and adopting a plasma chemical modification process; coating a layer of a macromolecule solution under the modified polyester film; drying, and compounding with a first traffic flow delay technology fusion modified polyolefin resin to form the auxiliary adhesive layer; cooling, carrying out online trimming, coating a second layer of the macromolecule solution under the auxiliary adhesive layer, drying, compounding with a second traffic flow delay technology fusion modified ethylene-vinyl acetate copolymer resin, and carrying out ozone treatment of a melt in the compounding process; and cooling, carrying out composite film surface photo-grafting, carrying out online trimming, and carrying out rolling molding. The composite film has a good bonging effect, and is safe and environmentally-friendly.

Description

[0001] technical field [0002] The invention relates to the fields of flexible electronic packaging, printing and packaging, in particular to a high-viscosity composite film for flexible electronic packaging applications and a processing method thereof. Background technique [0003] Flexible electronic technology is an emerging electronic technology that manufactures organic or inorganic material electronic devices on flexible, ductile plastic or thin metal substrates. , national defense and other fields have broad application prospects. [0004] Flexible electronic packaging is a branch of flexible electronic technology. It is a highly reliable and flexible technology made of polyimide or polyester film as the base material. It has high wiring density and low weight. Features of light and thin thickness. Among them, the covering film is the main process of flexible electronic packaging. [0005] Existing composite film packaging materials include substrates, sealing mat...

Claims

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Application Information

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IPC IPC(8): B32B27/08B32B27/36B32B37/15B32B38/04B29C43/30
Inventor 胡振王军林
Owner 宜兴市王者塑封有限公司
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