Composite material of modified boride filled with epoxy resin

A technology of epoxy resin and composite materials, applied in the field of composite materials and high-performance composite materials, can solve the problems of high temperature and easy wear of pure epoxy resin

Inactive Publication Date: 2013-07-31
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of high temperature and easy wear of pure epoxy resin by adding high-performance boride ceramic fillers into epoxy resin, and provide a high heat-resistant

Method used

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  • Composite material of modified boride filled with epoxy resin
  • Composite material of modified boride filled with epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Add 25g of bisphenol A and 50ml of NaOH solution with a mass concentration of 10% into a 250ml round bottom flask, heat up and stir, dissolve at 70°C, and then cool down to 50°C. Add 2g of metal boride / Al surface modified by silane coupling agent 2 o 3 For multi-phase particle powder, the stirring rate is controlled at 800r / min. Under ultrasonic vibration, the powder particles are fully dispersed in the system; over. After the dropwise addition, the temperature was raised to 85° C., and after 6 hours of reaction, 2.5 g of fatty amine curing agent was added, and stirred at high speed for 20 minutes. After vacuum degassing, it was quickly injected into the mold, placed in an oven at 100°C for 5hrs, and at 130°C for 3hrs to obtain 28.59g of modified boride-filled epoxy resin composites. The test results show that the glass transition temperature Tg of the composite material is 108.8°C (under the same experimental conditions, the glass transition temperature Tg of epoxy ...

Embodiment 2

[0019] Add 50g of bisphenol A and 60ml of NaOH solution with a mass concentration of 20% into a 250ml round bottom flask, heat up and stir, dissolve at 70°C, and then cool down to 50°C. Add 5g of metal boride / Al whose surface is modified by titanate coupling agent 2 o 3 For multi-phase particle powder, the stirring rate is controlled at 900r / min. Under ultrasonic vibration, the powder particles are fully dispersed in the system; over. After the dropwise addition, the temperature was raised to 95°C, and after 2 hours of reaction, 6.5 g of aromatic amine curing agent was added, and stirred at high speed for 20 minutes. After vacuum degassing, it was quickly injected into the mold, placed in an oven at 80°C for 6hrs, and at 120°C for 4hrs to obtain 57.18g of modified boride-filled epoxy resin composites. The test results show that the glass transition temperature Tg of the composite material is 110.8°C; under dry friction room temperature conditions, when it is rubbed against ...

Embodiment 3

[0021] Add 80g of bisphenol A and 110ml of NaOH solution with a mass concentration of 15% into a 250ml round bottom flask, heat up and stir, dissolve at 70°C, and then cool down to 50°C. Add 8.9g of metal boride / Al whose surface is modified by aluminate coupling agent 2 o 3 For multi-phase particle powder, the stirring rate is controlled at 1000r / min. Under ultrasonic vibration, the powder particles are fully dispersed in the system; Drip finished. After the dropwise addition, the temperature was raised to 95°C, and after 2 hours of reaction, 10.5 g of aromatic amine curing agent was added, and stirred at high speed for 20 minutes. After vacuum degassing, it was quickly injected into the mold, placed in an oven at 120°C for 4hrs, and at 150°C for 2hrs to obtain 91.45g of modified boride-filled epoxy resin composites. The test results show that the glass transition temperature Tg of the composite material is 99.4°C; under dry friction at room temperature, when it is rubbed a...

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Abstract

The invention belongs to the technical field of high-performance composite materials, and specifically relates to a composite material of modified boride filled with epoxy resin, more specifically to a composite material which is obtained by modifying a high-performance ceramic powder surface by an organic functional group and filling organic resin and has homogeneous microstructure and excellent heat resistance and wear resistance. Through an in situ polymerization method for preparation, bisphenol A is firstly dissolved in a NaOH solution completely, the boride powder with the surface modified by the organic functional group is added, ultrasonic oscillation and intense agitation for dispersion are carried out, chloropropylene oxide is then added for polymerization, a curing agent is added, and curing molding is carried out at a high temperature. The prepared composite material of modified boride filled with epoxy resin has structural features of homogeneous material microstructure and excellent heat resistance and wear resistance, and can be applied in high-temperature wear-resistant members required in the industrial fields of aviation, automobile and the like.

Description

technical field [0001] The invention belongs to the technical field of high-performance composite materials, specifically relates to a modified boride-filled epoxy resin composite material, and more specifically relates to a high-performance ceramic powder whose surface is modified by an organic functional group and then filled with an organic resin to obtain a microstructure Composite material with uniformity, excellent heat resistance and friction and wear properties. Background technique [0002] As an excellent thermosetting polymer material, epoxy resin is widely used in coatings, adhesives and composite materials in engineering due to its advantages of light weight and low price. At the same time, epoxy resin also has comprehensive properties such as high strength, high modulus, good dimensional stability and corrosion resistance, and has broad application prospects in the fields of chemical industry, automobile and aerospace. However, due to the three-dimensional cro...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08K9/06C08K9/04C08K3/38C08K3/32C08G59/50C08G59/06
Inventor 于志强
Owner FUDAN UNIV
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