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High temperature resistant mica tape adhesive and preparation method thereof

A technology of mica tape and adhesive, applied in the direction of adhesive types, adhesives, epoxy resin glue, etc., can solve the problems of high price, unfavorable large-scale popularization and application, and high cost of polyetherimide resin

Inactive Publication Date: 2013-08-14
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] (2) Monomers such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP) are expensive, resulting in high cost of polyetherimide resin (HPEI) and adhesives, which is not conducive to Large-scale promotion and application can only be limited to some special fields

Method used

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  • High temperature resistant mica tape adhesive and preparation method thereof
  • High temperature resistant mica tape adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] 216 g (1.0 mol) of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 358 g (1.0 mol) of 4,4'-bismaleimidodiphenyl Put methane into the reactor, heat to 80°C, stir and react for 2 hours, then cool to room temperature to obtain 574 g of DB resin, which is designated as DB-1.

[0038] 216 g (1.0 mol) of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 570 g (1.0 mol) of 2,2-bis[4-(4-maleyl Iminophenoxy)phenyl]propane was put into a reaction kettle, heated to 100°C, stirred for 1 hour, and then cooled to room temperature to obtain 786 g of DB resin, designated as DB-2.

[0039] 216 g (1.0 mol) of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 285 g (0.5 mol) of 2,2-bis[4-(4-maleoyl Iminophenoxy)phenyl]propane was put into a reaction kettle, heated to 90°C, stirred and reacted for 1 hour, then cooled to room temperature to obtain 501 g of DB resin, designated as DB-3.

[0040] 216 g (1.0 mol) of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 358 g (...

Embodiment 2

[0042] 50 grams of N,N,N',N'-tetraglycidyl-3,3'-dimethyl-4,4'-diaminodiphenylmethane epoxy resin and 50 grams of N,N,N', N',O-pentaglycidyl-4,4'-diamino-4"-hydroxytriphenylmethane epoxy resin, 10 grams of SR22000 silicone resin and 20 grams of 2,2-bis[4-(2,4 -Put dimaleimidophenoxy)phenyl]hexafluoropropane into the reaction kettle, heat up to 80°C, stir and react for 1 hour, then cool to 30°C, add 80 g of N-methyl-2 -Pyrrolidone, 5 grams of DB-1 resin and 5 grams of DB-2 resin were stirred and mixed uniformly to obtain 220 grams of homogeneous transparent and viscous A component resin solution, which was designated as A-1.

[0043] 100 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin, 5 grams of SR22000 silicone resin, 5 grams of 1,4-bis(2,4 -Bismaleimidophenoxy)benzene and 5 grams of 2,2-bis[4-(2,4-bismaleimidophenoxy)phenyl]hexafluoropropane into the reactor In the medium, heat up to 100°C, stir and react for 0.5 hours, then cool to 40°C, add 20 gra...

Embodiment 3

[0046] Mix and dissolve 5 grams of 1,3-bis(2,4-diaminophenoxy)benzene and 20 grams of N-methyl-2-pyrrolidone to obtain 25 grams of component B, which is designated as B-1.

[0047] 5 grams of 1,3-bis(2,4-diaminophenoxy)benzene and 5 grams of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane were mixed with 100 grams of N , N dimethylacetamide mixed and dissolved to obtain 110 grams of component B, denoted as B-2.

[0048] 10 grams of 1,4-bis(2,4-diaminophenoxy)benzene and 5 grams of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane with 100 Grams of N,N dimethylformamide were mixed and dissolved to obtain 115 grams of component B, which was denoted as B-3.

[0049] Mix 10 grams of 1,4-bis(2,4-diaminophenoxy)benzene and 10 grams of 4,4'-bis(2,4-diaminophenoxy)diphenyl sulfone with 150 grams of N,N di Methylformamide and 50 grams of xylene are mixed and dissolved to obtain 220 grams of B component, which is denoted as B-4.

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Abstract

The invention relates to a high temperature resistant mica tape adhesive and a preparation method thereof. The high temperature resistant mica tape adhesive comprises epoxy resin, organic silicone resin, tetra-maleimide resin, DB resin, an aromatic tetramine curing agent and an organic solvent according to a mass ratio of 100:(5-10):(10-20):(10-20):(5-20):(100-300). The preparation method comprises the following steps of: placing the epoxy resin, the organic silicone resin and the tetra-maleimide resin in a reaction kettle, then adding the organic solvent and the DB resin, stirring and mixing uniformly to obtain a compound A; mixing and dissolving the aromatic tetramine curing agent and the organic solvent to obtain a compound B; when in use, mixing the compounds A and B uniformly. The high temperature resistant mica tape adhesive is simple in preparation technology and excellent in combination property, can be applied to high temperature resistant mica tapes with few or more glue powder of a large motor main insulation system, and has a good application prospect.

Description

technical field [0001] The invention belongs to the field of organic polymer adhesives and preparation thereof, in particular to a high-temperature-resistant mica tape adhesive and a preparation method thereof. Background technique [0002] The development of modern large and medium-sized high-voltage motor technology has put forward higher and higher requirements for the insulation performance of the motor. The operating temperature, rated power, capacitance, and volume of the motor have increased significantly, and the insulation structure has to withstand higher electrical stress, mechanical stress, thermal stress and environmental stress, and the working environment of the motor has become increasingly harsh. This requires insulating materials to have better insulation and heat resistance properties. As one of the main insulating materials, the performance of the mica tape plays a decisive role in the quality of the insulation performance. Adhesive is the most importan...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/08C09J183/04C08G59/50
Inventor 虞鑫海
Owner DONGHUA UNIV
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