Polyamide resin and polyamide composition composed thereof

A polyamide composition and polyamide resin technology, applied in the field of polyamide compositions, can solve the problems affecting the surface morphology of products, obstacles to the expansion of application fields, insufficient toughness of copolymers, etc., and achieve high toughness, high heat resistance, resistance to hot effect

Inactive Publication Date: 2013-08-21
KINGFA SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, similar to PA66, due to the high concentration of amide bonds in PA6T, its water absorption rate is high, which leads to a series of restrictions on use.
At the same time, PA6T-related copolymers also have the problem of insufficient toughness, which needs to be improved urgently.
In addition, the problem of floating fibers on the surface of injection molded products also seriously affects the surface morphology of products, which becomes an obstacle to the expansion of application fields

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~13 and comparative example 1~9

[0062] In the autoclave equipped with magnetic coupling stirring, condenser, gas phase port, feed port, pressure explosion-proof port, add the reaction raw materials according to the ratio in the table; add benzoic acid, sodium hypophosphite and deionized water; the amount of benzoic acid It is 2.5% of the total amount of diamine, diacid, lactam and amino acid, the weight of sodium hypophosphite is 0.1% of the weight of other feeding materials except deionized water, and the weight of deionized water is 30% of the total weight of feeding; Enter high-purity nitrogen as a protective gas, and heat up to 220°C within 2 hours under stirring. o C, the reaction mixture was heated at 220 o C was stirred for 1 hour, and then the temperature of the reactant was raised to 230 o C; response at 230 o The constant temperature of C and the constant pressure of 2.2MPa continued for 2 hours, and the pressure was kept constant by removing the formed water. After the reaction was completed, th...

Embodiment 14-19 and comparative example 10~14

[0069] Mix polyamide resin, flame retardant, and other additives uniformly in the high mixer according to the formula in Table 2, and then add them into the twin-screw extruder through the main feeding port, and feed the reinforcing filler through the side feeding scale to extrude out, cooled with water, granulated and dried to obtain the polyamide composition. Among them, the extrusion temperature is 330 o c.

[0070] In table 2, the formulations in the following table are parts by weight

[0071] Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 Comparative Example 10 Comparative Example 11 Comparative Example 12 Comparative Example 13 Comparative Example 14 Polyamide resin Example 2 Example 2 Example 4 Example 7 Example 2 Example 2 Comparative Example 1 Comparative Example 1 Comparative Example 5 Comparative Example 5 Comparative Example 1 Resin content 70 50 70 50 30 99.9 70 50 70 5...

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Abstract

The invention discloses a polyamide resin, which is composed of the following repeated unit components: a component A which is 80-99mol/% of a 10T unit formed by decamethylene diamine and terephthalic acid; and a component B which is 1-20mol/% of a 1010 unit formed by decamethylene diamine and sebacic acid, wherein the sebacic acid is substituted by m-phthalic acid or other aliphatic dicarboxylic acid containing 2-14 carbon atoms. A polyamide composition containing the polyamide resin comprises the following components in percentage by weight: 30-99.9% of polyamide resin, 0-60% of reinforcing filler, 0-50% of flame retardant, and 0.1 to 10% of other auxiliary agents. The polyamide resin and the composition composed thereof disclosed by the invention have the advantages that with the water saturated absorptivity lower than 0.8wt%, and the resin and the composition can be applied to situations in which the requirement on water saturated absorptivity is high, such as being applied to an engine oil pipe; with the melting point higher than 260 DEG C, and strong heat resistance, and the resin and the compositions can be applied to situations in which the reflow soldering temperature exceeds 260 DEG C; with the breaking elongation of 14-45%, and the notch impact strength of 6.9-12.0kJ/m2 (23 DEG C), the resin and the composition have high tenacity and can be applied to situations in which the requirement on water saturated absorptivity is high, such as being applied to an engine oil pipe.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polyamide resin and a polyamide composition composed of it. Background technique [0002] Polyamide is widely used because of its good comprehensive properties, including mechanical properties, heat resistance, wear resistance, chemical resistance and self-lubrication, low coefficient of friction, certain flame retardancy, and easy processing. It is suitable for filling with glass fiber and other fillers to enhance modification, improve performance and expand application range, etc. In recent years, semi-aromatic polyamides have been focused on development due to their better heat resistance and mechanical properties. [0003] Semi-aromatic high-temperature resistant polyamide PA6T copolymers have long been known for their high fluidity and high temperature resistance. However, similar to PA66, due to the high concentration of amide bonds in PA6T, its water absorption rate is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/26C08L77/06C08L77/00C08L25/06C08K13/06C08K7/04C08K7/14C08K3/04C08K9/04C08K3/34C08K5/521C08K5/5313
CPCC08L77/06C08G69/265C08K5/51C08K7/14C08L25/18
Inventor 张传辉蔡彤旻吉继亮曾祥斌曹民夏世勇叶南飚陈大华
Owner KINGFA SCI & TECH CO LTD
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