Cored solder wire solid soldering flux capable of reducing flyoff

A technology of flux and solder wire, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of scattering pollution, achieve the effect of increasing brightness, good high temperature resistance, and preventing tin beads

Active Publication Date: 2013-08-28
广东中实金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to solve the problem of scatter pollution in tin welding, and provide a cored solder wire solid flux that can reduce scatter, thereby not only improving product quality, but also improving soldering product quality, reducing the Solving Problems of Flying Pollutants in Tin Soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Take nonionic surfactant FT900 0.2g, cetyl bromide 0.3g and fluorocarbon surfactant FSN100 0.5g compound surfactant 1.0g, succinic acid 2.0g and fumaric acid 2.0g compound organic 4.0g of acid, 0.75g of tetrahydrofurfuryl alcohol and 0.75g of polyisobutylene with a molecular weight of 2400 compounded plasticizer 1.5g, hydrogenated rosin AHR-120H 58.44 and colorless hydrogenated rosin QHS-301 35.06g compounded rosin 93.5g;

[0041] Crush the above 93.5g of compound rosin into a block with a diameter of less than 1cm, add it to the reactor, heat it to 140±5°C and stir evenly, place it at a constant temperature for 5 minutes, then add 1.0g of compound surfactant, 4.0g of compound organic acid and 1.5 g of the compound plasticizer was continuously stirred and evenly poured into a mold to obtain the solid flux product of the present invention.

Embodiment 2

[0043] Get 0.38g of nonionic surfactant FT900, 0.47g of cetylpyridine bromide and 1.8g of compound surfactant of fluorocarbon surfactant FSN100 0.95g, 0.33g of succinic acid, 0.33g of citric acid and 0.34g of malic acid g compounded organic acid 1.0g, tetrahydrofurfuryl alcohol 2.0g and polyisobutylene with a molecular weight of 2400 1.0g compounded plasticizer 3.0g, hydrogenated rosin AHR-120H 56.52g and colorless hydrogenated rosin QHS-301 37.68g compounded rosin 94.2g;

[0044] Crush the above 94.2g compounded rosin into a block with a diameter of less than 1cm, add it to the reactor, heat it to 140±5°C, stir evenly, keep it at a constant temperature for 5 minutes, then add 1.8g compounded surfactant, 1.0g compounded organic acid and 3.0 g of the compound plasticizer was continuously stirred and evenly poured into a mold to form the solid flux product of the present invention.

Embodiment 3

[0046] Take 0.66 g of nonionic surfactant FT900, 0.66 g of cetylpyridine bromide and 3.0 g of compound surfactant of fluorocarbon surfactant FSN100 1.68 g, 1.2 g of succinic acid, 0.6 g of citric acid and 0.6 g of malic acid g compounded organic acid 2.4g, tetrahydrofurfuryl alcohol 0.71g and polyisobutylene with a molecular weight of 2400 0.29g compounded plasticizer 1.0g, hydrogenated rosin AHR-120H 52.0g and colorless hydrogenated rosin QHS-301 41.6g compounded rosin 93.6g;

[0047] Grind the above 93.6g compounded rosin into lumps with a diameter of less than 1cm, add it into the reactor, heat it to 140±5°C and stir evenly, place it at constant temperature for 5 minutes, then add 3.0g compounded surfactant, 2.4g compounded organic acid and 1.0 g of compound plasticizer is continuously stirred and evenly poured into a mold to form the solid flux product of the present invention.

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Abstract

The invention relates to a cored solder wire solid soldering flux capable of reducing flyoff. The cored solder wire solid soldering flux consists of a compound surfactant, compound organic acid, a compound plasticizer and compound rosin, and is prepared by the following steps of: grinding the balance of the compound rosin into blocks, adding into a reactor, heating, stirring and placing at constant temperature; and adding 1.0 to 3.0 percent of compound surfactant, 1.0 to 4.0 percent of compound organic acid and 1.0 to 3.0 percent of compound plasticizer sequentially, continuing stirring, uniformly pouring into a mold, and molding to obtain a solid soldering flux product. The soldering flux has the advantages that the content of halogen can be controlled to be less than 1,000ppm, and completely accords with a halogen-free standard; the quantity of soldering flux residue and flyoff solder balls in a welding process of a solder wire and the flyoff distance are greatly decreased; softening points are improved; the soldering flux is high in high temperature resistance and high in insulating resistance; an acid value is increased; and the activity is improved.

Description

technical field [0001] The invention relates to a cored solder wire solid flux capable of reducing scattering, belonging to the field of electronic welding materials. Background technique [0002] With the rapid development of electronic information products, the soldering quality of PCB boards is becoming more and more stringent, especially problems such as residues, cracks, and peeling are the key factors that directly affect the quality. In the GB / T9491 standard for tin soldering, the flying test is not included in the detection The project, while ISO9454, JIS-E3197 international standards and Japanese industrial standards, the key content of the scattering test to detect the quality of welding materials, in order to meet international standards, must solve the problem of flying pollutants in tin welding. Contents of the invention [0003] The object of the present invention is to solve the problem of scatter pollution in tin welding, and provide a cored solder wire sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 杨嘉骥方喜波孙玉欣孟昭辉梁静珊孙淼何淑芳
Owner 广东中实金属有限公司
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