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Preparation method of bismaleimide prepolymer and conductive silver adhesive prepared thereby
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A bismaleimide, conductive silver glue technology, applied in conductive adhesives, adhesives and other directions, can solve the problems of high curing temperature, high curing brittleness, low impact strength, etc., to achieve high bonding strength, bonding The effect of high force and high conductivity
Inactive Publication Date: 2013-08-28
SHENZHEN EVER GLORY PHOTOELECTRICITY
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[0004] However, due to the low impact strength, high curing temperature, poor solubility, and high curing brittleness of the general-purpose bismaleimide resin, its application and development are limited, so it is necessary to modify the bismaleimide resin
[0005] Allyl phenyl compound modified bismaleimide resin is widely used in the field of high-performance composite materials, but there are still many shortcomings in the stability of the resin prepolymer, such as the resin prepolymer must be stored at low temperature Preservation, the stability of the organic solution system such as acetone of the resin prepolymer is poor. Generally, if it is placed for more than 7 days, precipitation will occur. In severe cases, precipitation will occur within 2 to 3 days.
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[0027] Preferably, the preparation method of bismaleimide prepolymer comprises the following steps: taking bismaleimide and dimethylformamide as raw materials, under the action of a catalyst, reacting with a methylene compound to generate bis Maleimide prepolymer.
[0028] Preferably, the preparation method of bismaleimide prepolymer comprises the following steps: mixing bismaleimide and dimethylformamide, heating and stirring to dissolve, then adding catalyst and methylene compound, 70~ The reaction was stirred at a constant temperature of 80°C to obtain the product. Preferably, the heating and stirring dissolution temperature is 70-80°C. Preferably, the stirring reaction time is 6-8 hours.
[0029] Preferably, the ratio of raw materials in the preparation process is as follows: 20-40 parts of bismaleimide, 46-60 parts of dimethylformamide, 10-30 parts of methylene compound, and 0.1-1 part of catalyst.
[0030] Preferably, the methylene compound is at least one of malononi...
Embodiment 1
[0036] In a 500ml three-necked flask, add 71g of bismaleimide and 200ml of dimethylformamide, heat up to 70°C and stir to dissolve and add 0.7g of triethylamine, then add 21.2g of acetoacetate Ketone, constant temperature 70°C, stirred for 8 hours to obtain bismaleimide prepolymer.
[0037] Take 100 parts of bismaleimide prepolymer and 3 parts of hydrogenated castor oil, heat and stir at 60°C to form a paste, then add 70 parts of micron flake silver powder, and mix well to obtain conductive silver glue.
Embodiment 2
[0039] In a 500ml three-necked flask, add 55g of bismaleimide and 150ml of dimethylformamide, heat up to 80°C and stir to dissolve and add 0.4g of triethylamine, then add 20g of propylene glycol Acetate diethyl ester at a constant temperature of 70°C and stir for 8 hours to obtain a bismaleimide prepolymer.
[0040] Take 80 parts of bismaleimide prepolymer and 5 parts of hydrogenated castor oil, heat and stir at 55°C to form a paste, then add 80 parts of micron spherical silver powder and mix well to obtain conductive silver glue.
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Abstract
The invention discloses a preparation method of a bismaleimide prepolymer and a conductive silver adhesive prepared thereby. The preparation method of the bismaleimide prepolymer comprises the following steps of: using bismaleimide and dimethylformamide as raw materials; and performing reaction with a methylene compound to generate the bismaleimide prepolymer under the effect of a catalyst. The conductive silver adhesive is prepared by mixing the bismaleimide prepolymer, silver powder and an assistant. The bismaleimide prepolymer prepared by the invention is high in bonding strength, low in cure shrinkage rate and further excellent in temperature resistance and medium resistance. The conductive silver adhesive is small in cure shrinkage rate, high in bonding force and good in temperature resistance and medium resistance, and has higher conductivity.
Description
technical field [0001] The invention relates to a preparation method of a bismaleimide prepolymer and a conductive silver glue prepared by using the same. Background technique [0002] Bismaleimide (BMI for short) is another type of resin system derived from polyimide resin system. It is a bifunctional compound with maleimide (MI) as the active terminal group. It is compatible with epoxy resin With similar fluidity and moldability, it can be processed and formed by the same general method as epoxy resin, which overcomes the relatively low heat resistance of epoxy resin. Therefore, it has been developed rapidly and widely used in the past two decades. . [0003] Bismaleimide resin is characterized by its excellent heat resistance, electrical insulation, wave transparency, radiation resistance, flame retardancy, good mechanical properties and dimensional stability, and its molding process is similar to epoxy resin. Widely used in aviation, aerospace, machinery, electronics a...
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