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Microwave dielectric ceramic Ba3Ti2V4O17 capable of realizing low temperature sintering and preparation method thereof

A technology of microwave dielectric ceramics and low-temperature sintering, applied in the field of dielectric ceramic materials, can solve the problems of restricting and restricting low-temperature co-firing technology and the development of microwave multilayer devices, and achieve the effect of large application value and small temperature coefficient of resonance frequency

Active Publication Date: 2013-10-09
苏州弘吴科技中介服务有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0010] In the process of exploring and developing new low-firing microwave dielectric ceramic materials, material systems such as Li-based compounds, Bi-based compounds, tungstate compounds, and tellurate-based compounds with inherently low sintering temperatures have received extensive attention and research. Because the compounds containing Bi, Te and Mo are easy to have interfacial reaction with the Ag electrode and the raw material TeO 2 Toxicity limits the application of these Bi, Te and Mo-based materials, so low-fire high-performance microwave dielectric ceramic systems are still very limited, which largely limits the development of low-temperature co-firing technology and microwave multilayer devices

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  • Microwave dielectric ceramic Ba3Ti2V4O17 capable of realizing low temperature sintering and preparation method thereof

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Embodiment

[0019] Table 1 shows three specific examples of different sintering temperatures constituting the present invention and their microwave dielectric properties. Its preparation method is as above, and the evaluation of microwave dielectric properties is carried out by the cylindrical dielectric resonator method; the powder is mixed with Ag powder accounting for 20% of the powder mass, pressed and molded, and sintered at 880 ° C; X-ray diffraction phase Both analysis and SEM observations showed that Ba 3 Ti 2 V 4 o 17 There is no chemical reaction with Ag, that is, Ba 3 Ti 2 V 4 o 17 It can be co-fired with Ag electrodes at low temperature.

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Abstract

The invention discloses a microwave dielectric ceramic Ba3Ti2V4O17 capable of realizing low temperature sintering and a preparation method thereof. A vanadate microwave dielectric ceramic material capable of realizing low temperature sintering has the composition of Ba3Ti2V4O17. The preparation method comprises the following steps of: (1) weighing and dosing original powder of BaCO3, TiO2 and V2O5 with the purity of over 99.9 percent according to a chemical formula of Ba3Ti2V4O17; (2) performing wet ball milling and mixing the raw materials in the step (1) for 12 hours, wherein the solvent is distilled water, and pre-sintering at the temperature of 750 DEG C in atmosphere for 6 hours after drying; and (3) adding an adhesive into the powder prepared in the step (2) and pelleting, pressing and forming, and finally, sintering at the temperature of 830-850 DEG C in atmosphere for 4 hours, wherein the adhesive is a polyvinyl alcohol solution with the mass concentration of 5 percent, and the dose accounts for 3 percent of the total mass of the powder. The prepared ceramic has good sintering performance at the temperature of 850-900 DEG C and has the dielectric constant of 15-16, quality factor Qf is up to 77000-93000GHz, the resonant frequency temperature coefficient is low, the microwave dielectric ceramic can be subjected to low-temperature co-firing with an Ag electrode, and the microwave dielectric ceramic has extremely high application value in industry.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave dielectric ceramic material for microwave components used at microwave frequencies, such as a dielectric substrate, a resonator, and a filter, and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in microwave frequency band (mainly UHF, SHF frequency band) circuits and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturization and integration. ...

Claims

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Application Information

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IPC IPC(8): C04B35/495C04B35/622
Inventor 方亮唐莹韦珍海
Owner 苏州弘吴科技中介服务有限公司
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