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Medium-high voltage electronic aluminum foil diffused tin nucleus electro-deposition method

An electronic aluminum foil, medium and high voltage technology, used in electrolytic capacitors, circuits, capacitors, etc., to improve the utilization rate and mechanical properties, reduce the occurrence of parallel holes, and improve the specific capacitance.

Active Publication Date: 2013-10-23
新疆广投桂东电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during this annealing process, the oxide film on the surface of the aluminum foil becomes denser, which becomes an obstacle for subsequent electrolytic corrosion pores.

Method used

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  • Medium-high voltage electronic aluminum foil diffused tin nucleus electro-deposition method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The lead-free aluminum foil with a purity of 99.99%, a thickness of 110 μm, and a cubic texture occupancy rate of more than 95% is boiled in boiling water at 100°C for 30 seconds, and a new water-containing film is formed on the surface of the aluminum foil. The above-mentioned aluminum foil is placed in a tin plating solution for electroplating. The composition of the plating solution is: 1wt% sodium stannate trihydrate + 0.1wt% acetic acid; graphite is used as an anode, and a new water-containing film is formed on the above-mentioned boiled surface. The medium and high voltage aluminum foil is used as the cathode, and the aluminum foil is charged into the electrolyte, where the temperature of the electroplating solution is 60°C, and the current density of the electrodeposition is 40mA / cm 2 , The electrodeposition time is 15 seconds.

[0025] The above-mentioned aluminum foil that has been electrodeposited on the surface to obtain dispersed tin nuclei is subjected to p...

Embodiment 2

[0027] Put lead-free aluminum foil with a purity of 99.99%, a thickness of 110 μm, and a cubic texture occupancy of more than 95% in an alkaline solution with a temperature of 60°C and a concentration of 2wt% for 15 seconds to form a new water-containing film on the surface of the aluminum foil back. The above-mentioned aluminum foil is placed in a tin plating solution for electroplating. The composition of the plating solution is: 1wt% sodium stannate trihydrate + 0.1wt% acetic acid; graphite is used as an anode, and a new water-containing film is formed on the above-mentioned boiled surface. The medium and high voltage aluminum foil is used as the cathode, and the aluminum foil is charged into the electrolyte, where the temperature of the electroplating solution is 60°C, and the current density of the electrodeposition is 40mA / cm 2 , The electrodeposition time is 15 seconds. The above-mentioned aluminum foil that has been electrodeposited on the surface to obtain dispersed ...

Embodiment 3

[0029] Put a lead-free aluminum foil with a purity of 99.99%, a thickness of 110 μm, and a cubic texture occupancy of more than 95% in a polishing solution for electrochemical polishing. The composition of the polishing solution is: volume concentration: 60% phosphoric acid + 40% Sulfuric acid + 1% glycerol mixed solution; the polishing current density is 60mA / cm when polishing 2 , the polishing time is 30 seconds, and a new water-containing film is formed on the surface of the aluminum foil. The above-mentioned aluminum foil is placed in a tin plating solution for electroplating. The composition of the plating solution is: 1wt% sodium stannate trihydrate + 0.1wt% acetic acid; graphite is used as an anode, and a new water-containing film is formed on the above-mentioned boiled surface. The medium and high voltage aluminum foil is used as the cathode, and the aluminum foil is charged into the electrolyte, where the temperature of the electroplating solution is 60°C, and the cur...

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Abstract

The invention relates to a medium-high voltage electronic aluminum foil diffused tin nucleus electro-deposition method. The method comprises the steps that: a high-purity medium-high voltage aluminum foil with no potential correction element enriched on the surface is pretreated in high-purity water, or an alkali solution, or a phosphoric acid solution, or nitric acid, such that surface oxide film is removed, and a new water-containing film is formed on the surface of the aluminum foil; or high-purity medium-high voltage aluminum foil with no potential correction element enriched on the surface is subjected to an electrochemical polishing treatment, such that an original oxide film on the surface of the aluminum foil is removed, and a new water-containing film is simultaneously formed on the surface of the aluminum foil; or an aluminum foil is pretreated in an alkali solution, or a phosphoric acid solution, or nitric acid, such that an alloy layer with enriched potential correction element on the surface of the medium-high voltage aluminum foil is removed, and a new water-containing film is formed on the surface of the aluminum foil; a rapid tin electro-deposition technology is adopted, such that diffused tin nuclei are deposited on the surface of the aluminum foil. With the medium-high voltage electronic aluminum foil with the diffused tin nucleus electro-deposited on the surface, in electrolytic corrosion, tunnel hole formation uniformity can be improved, and aluminum self-corrosion thinning can be reduced, such that aluminum foil specific capacitance and bending resistance performance can be substantially improved.

Description

technical field [0001] The invention relates to the field of manufacturing medium and high voltage anode foils and corroded foils for aluminum electrolytic capacitors, in particular to a method for electrodepositing dispersed tin crystal nuclei on medium and high voltage electronic aluminum foils. Background technique [0002] The medium and high voltage aluminum foil for aluminum electrolytic capacitors refers to the aluminum foil with a working voltage above 160V, and the thickness of the formed film needs to be greater than 200nm, which requires a large space for the corrosion holes formed by the medium and high voltage aluminum foil. Therefore, the medium and high pressure aluminum foil cannot adopt the sponge-like pitting structure of the low pressure aluminum foil. The corrosion of high-pressure aluminum foil is mainly based on the formation of tunnel holes with larger apertures on the (100) surface of the aluminum. In order to obtain a high specific capacitance of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/44C25D3/30H01G9/055
Inventor 何业东彭宁梁力勃宋洪洲杨小飞蔡小宇熊传勇
Owner 新疆广投桂东电子科技有限公司
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