Three-dimensional packaging method having heat radiation function

Abstract

The invention discloses a three-dimensional packaging method having a heat radiation function, which belongs to the technical field of heat radiation and packaging, and can be applied to three-dimensional packaging with relatively large thermal power density. According to the method, three-dimensional stacking of chips through micro-convex points on vertical interconnections of functional chips, wherein the vertical interconnection of a single chip is realized through conductive materials such as copper and aluminum; the material of the micro-convex points is a good conductive material, and the micro-convex points are realized through methods such as electroplating, ball planting or silk-screen printing. A sidewall of a sealed package is provided with small holes for a coolant to perform continuous circulating heat radiation under an external effect which is mainly realized through an inlet and an outlet of the coolant of an outer wall of the sealed package. Through the chip stacking that is realized through direct contact of micro-convex points among the chips, the integration level is improved, and at the same time, vertical distances between upper and lower chips are guaranteed, and convenience is brought to flowing and heat radiation of the coolant. Since the coolant is in direct contact with chips in a package body, the heat radiation is relatively efficient, and since the flow velocity of the coolant at the outlet and the inlet are controlled, the heat radiation is enabled to be controllable and can be adjusted according to actual work condition.

Description

technical field [0001] The invention relates to a three-dimensional packaging method with heat dissipation function, which can be used for three-dimensional high-density packaging with high heat dissipation requirements, and belongs to the technical field of heat dissipation and microelectronic packaging. Background technique [0002] In 1947, Shortley and others invented the transistor, a breakthrough in the field of microelectronics technology. Then Kilby and others invented the integrated circuit. Since then, the entire circuit's resistors, capacitors, inductors, diodes, and triodes can be concentrated on a semiconductor through microelectronics technology, which greatly reduces the size of traditional circuits. Integrated circuits have developed rapidly. In 1965, Moore proposed the famous Moore's Law, which states that the number of transistors integrated on an integrated circuit chip doubles every 18 months, and the performance of integrated circuits doubles every 18 m...

AI Technical Summary

Problems solved by technology

Chips are stacked in various ways to improve integration and reduce the volume of the application system, but it also creates a serious problem, that is, the thermal management problem caused by excessive power consumption per unit volume

When some highly integrated processing chips are three-dimensionally packaged, the power density of the entire package reaches a large value, which will lead to an increase in the temperature of the packaged device, affecting the working performance of the device, shortening the working life of the device, and even due to high temperature cause direct damage to the device

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