The invention discloses a three-dimensional packaging method having a heat
radiation function, which belongs to the technical field of heat
radiation and packaging, and can be applied to three-dimensional packaging with relatively large thermal
power density. According to the method, three-dimensional stacking of chips through micro-convex points on vertical interconnections of functional chips, wherein the vertical
interconnection of a
single chip is realized through
conductive materials such as
copper and aluminum; the material of the micro-convex points is a good conductive material, and the micro-convex points are realized through methods such as
electroplating, ball planting or silk-
screen printing. A sidewall of a sealed
package is provided with small holes for a
coolant to perform continuous circulating heat
radiation under an
external effect which is mainly realized through an inlet and an outlet of the
coolant of an outer wall of the sealed
package. Through the
chip stacking that is realized through direct contact of micro-convex points among the chips, the integration level is improved, and at the same time, vertical distances between upper and lower chips are guaranteed, and convenience is brought to flowing and heat radiation of the
coolant. Since the coolant is in direct contact with chips in a
package body, the heat radiation is relatively efficient, and since the flow velocity of the coolant at the outlet and the inlet are controlled, the heat radiation is enabled to be controllable and can be adjusted according to actual work condition.