Sesquiterpene-containing film-forming resin and positive 248 nm photoresist thereof

A technology of film-forming resin and sesquiterpene, which is applied in the field of deep ultraviolet (DUV) positive chemically amplified photoresist composition, and can solve the problems of damaging the lens of the exposure machine and affecting the photolithographic pattern

Active Publication Date: 2013-11-13
昆山西迪光电材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a film-forming resin containing natural product sesquiterpenes (Sesquiterpenes) and a deep ultraviolet (DUV) film for exposure light source with KrF laser (wavelength 248nm) prepared by using this film-forming resin Positive chemically amplified photoresist composition, the purpose of which is to effectively improve the adhesion performance of the existing polyhydroxystyrene (PHS)-based film-forming ag

Method used

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  • Sesquiterpene-containing film-forming resin and positive 248 nm photoresist thereof
  • Sesquiterpene-containing film-forming resin and positive 248 nm photoresist thereof
  • Sesquiterpene-containing film-forming resin and positive 248 nm photoresist thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] Embodiment one: a kind of film-forming resin containing sesquiterpene

[0072] The film-forming resin is a copolymer prepared by copolymerization of comonomers in a solvent in the presence of a free radical initiator, and the comonomers are composed of the following compounds in parts by weight:

[0073] 24.0 grams of p-acetoxystyrene;

[0074] Styrene 10.4 g;

[0075] 25.6 grams of tert-butyl acrylate;

[0076] Cedaryl alcohol methacrylate 105.0 g.

[0077] The copolymerization reaction formula is as follows:

[0078]

[0079] Preparation method: In a 1000ml three-neck flask equipped with an electric stirrer, condenser, thermometer, temperature controller, heating mantle and nitrogen inlet, add 24.0 grams of p-acetoxystyrene, 10.4 grams of styrene, and tert-butyl acrylate 25.6 grams, 105.0 grams of cedarwood alcohol methacrylate, 500 grams of tetrahydrofuran, nitrogen gas under stirring for 10 minutes, then heated to 60~70 ° C, dropwise added azobisisobutyronitr...

Embodiment 2

[0081] Embodiment two: a kind of film-forming resin containing sesquiterpene

[0082] The film-forming resin is a copolymer prepared by copolymerization of comonomers in a solvent in the presence of a free radical initiator, and the comonomers are composed of the following compounds in parts by weight:

[0083] 97.2 grams of p-hydroxystyrene;

[0084] 26.4 grams of p-tert-butoxystyrene;

[0085] Cedaryl alcohol acrylate 52.5 g.

[0086] Preparation method: In a 1000ml three-neck flask equipped with an electric stirrer, condenser, thermometer, temperature controller, heating mantle and nitrogen inlet, add 97.2 grams of p-acetoxystyrene and 26.4 grams of p-tert-butoxystyrene , 52.5 grams of cedarwood alcohol acrylate, 400 grams of tetrahydrofuran, nitrogen gas for 10 minutes under stirring, then heated to 65~70 ° C, adding 8.8 grams of azobisisobutyronitrile (abbreviated as AIBN) in 100 grams of tetrahydrofuran. The solution was then added to the reaction system, and the reac...

Embodiment 3

[0088] Embodiment three: a kind of film-forming resin containing sesquiterpene

[0089] The film-forming resin is a copolymer prepared by copolymerization of comonomers in a solvent in the presence of a free radical initiator, and the comonomers are composed of the following compounds in parts by weight:

[0090] 93.0 grams of p-acetoxystyrene;

[0091] Styrene 5.5 grams;

[0092] Patchouli alcohol acrylate 63.1 grams;

[0093]Preparation method: In a 1000ml three-necked flask equipped with an electric stirrer, a condenser, a thermometer, a temperature controller, a heating mantle and a nitrogen inlet, add 93.0 grams of p-acetoxystyrene, 5.5 grams of p-styrene, and patchouli alcohol 9.0 grams of acrylate, 400 grams of tetrahydrofuran, blow nitrogen for 10 minutes under stirring, then heat to 60~70 ° C, add 11 grams of azobisisobutyronitrile (AIBN) in 100 grams of tetrahydrofuran to make a solution and then add In the reaction system, after continuing to reflux for 8 to 18 h...

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Abstract

A sesquiterpene-containing film-forming resin and a positive 248 nm photoresist thereof are characterized in that: the film-forming resin is a copolymer prepared by copolymerization of comonomers in a solvent in the presence of a radical initiator, and the comonomers mainly comprise 5-40 parts by weight of substituted styrene and 10-60 parts by weight of a sesquiterpene-containing constitutional unit; and the positive 248 nm photoresist mainly consists of 10-35 parts by weight of the film-forming resin, 0.5-6 parts by weight of a photoinduced acid, 70-90 parts by weight of a solvent and 0.01-0.5 part by weight of an organic base. The film-forming resin of the invention is a new modified film-forming resin prepared by introducing a polymerisable monomer containing a natural product sesquiterpene to a conventional poly(p-hydroxystyrene)-based film-forming resin. The new film-forming resin is capable of increasing transparency of the photoresist at exposure wavelength of 248 nm, improving photosensitivity of the photoresist, increasing adhesive property between HMDS-treated silicon chips, having no influence on photo-etched pattern and no damage to expensive lens of an exposure machine, improving heat resistance of the photoresist and substantially improving anti-etching performance of the photoresist.

Description

technical field [0001] The invention relates to a film-forming resin and photoresist thereof, in particular to a film-forming resin containing a sesquiterpene copolymer and a film-forming resin prepared by using the film-forming resin for using KrF laser (wavelength 248nm) as A deep ultraviolet (DUV) positive chemically amplified photoresist composition exposed to a light source. Background technique [0002] Photoresist is a key functional material in the photolithography process in the large-scale integrated circuit industry. The film-forming resin contained in it is an important part of the photoresist. The chemical and physical properties of the film-forming resin directly affect the photoresist. Effects of use in the large-scale integrated circuit industry. The film-forming resin and its photoresist, which were developed in the 1980s with polyhydroxystyrene (PHS) as the main component, are widely used in the manufacture of large-scale integrated circuits. The photolit...

Claims

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Application Information

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IPC IPC(8): C08F220/18C08F212/14G03F7/039
Inventor 冉瑞成沈吉贺宝元吴俊
Owner 昆山西迪光电材料有限公司
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