Electroconductive tape and method for manufacturing same

A conductive tape, conductive technology, applied in chemical instruments and methods, electrical components, magnetic field/electric field shielding, etc. Excellent strength and handleability

Active Publication Date: 2015-02-11
SEIREN CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the non-woven fabric is made thinner, the tensile strength will decrease significantly, and there is a problem that the conductive tape will be cut due to the handling at the time of sticking.
In the case of using metal foil as the base material, there is a problem that the adhesive layer is peeled off due to the deformation of the metal foil

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electroconductive tape and method for manufacturing same
  • Electroconductive tape and method for manufacturing same
  • Electroconductive tape and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] (Making conductive mesh fabric)

[0087] Pretreated at 190°C, the warp and weft are made of monofilaments made of polyethylene terephthalate with a diameter of 27 μm (denier 8 dtex), and the density of warp and weft is 132 per inch. Flat fabric. Thereafter, calendering was performed at a temperature of 150° C. and a linear pressure of 30 kg / cm. This mesh flat fabric was immersed in a 40° C. aqueous solution containing 0.3 g / L of palladium chloride, 30 g / L of stannous chloride, and 300 ml / L of 36% hydrochloric acid for 2 minutes, and then washed with water. Next, it was immersed in fluoboric acid at an acid concentration of 0.1N at 30° C. for 5 minutes, and then washed with water. Next, it was immersed in a 30° C. electroless copper plating solution containing 7.5 g / L of copper sulfate, 30 ml / L of 37% formaldehyde, and 85 g / L of potassium sodium tartrate for 5 minutes, and then washed with water. Next, in a nickel electroplating solution containing 300g / L of nickel su...

Embodiment 2

[0099] (Making conductive mesh fabric)

[0100] Pretreated at 190°C, the warp and weft are made of monofilaments made of polyethylene terephthalate with a diameter of 27 μm (denier 8 dtex), and the density of warp and weft is 132 per inch. Flat fabric. Then, plating was performed in the same manner as in Example 1. The maximum thickness of the obtained conductive mesh fabric was 47 μm, and its opening ratio was 72%.

[0101] (adhesive coating treatment)

[0102] Using a comma direct coater, the gap between the release sheet (SLK-80KCT: manufactured by Sumika Paper Co., Ltd.) and the comma head was adjusted to 110 μm, and the same adhesive coating liquid as in Example 1 was evenly applied. Then, it was made to pass through the inside of the dryer of 120 degreeC, and the adhesive layer of thickness 40 micrometers was obtained. The prepared conductive mesh fabric and other release sheets (EKR90R: manufactured by Lintec Co., Ltd.) were laminated on this adhesive layer. Then u...

Embodiment 3

[0106] (Making conductive mesh fabric)

[0107] The monofilament made of polyethylene terephthalate with a diameter of 27 μm (denier 8 dtex) in the warp and the monofilament made of polyethylene terephthalate with a diameter of 27 μm (denier 8 dtex) in the weft are pretreated at 190°C. A net-shaped flat fabric composed of silk and silk with a warp and weft density of 100 threads per inch. Next, calendering was performed at a temperature of 90° C. and a linear pressure of 30 kg / cm. Thereafter, this mesh flat fabric was subjected to electroplating in the same manner as in Example 1. The obtained conductive mesh fabric had a maximum thickness of 28 µm and an opening ratio of 80%.

[0108] (adhesive coating treatment)

[0109] Using a comma direct coater, the gap between the release sheet (SLK-80KCT: manufactured by Sumika Paper Co., Ltd.) and the comma head was adjusted to 60 μm, and the same adhesive coating liquid as in Example 1 was evenly applied. Then, it was made to pas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
contact resistanceaaaaaaaaaa
Login to view more

Abstract

An electroconductive tape (10) is characterized in that an adhesive film (3) composed of an adhesive is provided only on the open space between threads of an electroconductive mesh fabric having a metallic coating on the surface, the metallic coating being exposed and not covered by the adhesive film (3) on both surfaces of the electroconductive mesh fabric; thermoplastic synthetic fiber monofilament thread is included in part of the threads of the electroconductive mesh fabric; a value M that is obtained by an Equation (1): M=[(B1+B2)−C] / (B1+B2) is within a range of 0.05 to 0.45 (where B1 is the average diameter of the monofilament in the thickness direction of the electroconductive tape at places other than at the crossing points, B2 is the average diameter of the thread that crosses the monofilament in the thickness direction of the electroconductive tape at places other than at the crossing points, and C is the thickness of the electroconductive tape at the crossing points where the monofilament crosses other thread).

Description

technical field [0001] The invention relates to a conductive belt and a manufacturing method thereof. In particular, it relates to a double-sided adhesive conductive tape and a manufacturing method thereof. Background technique [0002] The conductive tape is used as an electromagnetic wave shielding gasket attached to a housing of an electronic device or the like in order to shield electromagnetic waves. Further, in the fields of portable electronic devices represented by mobile phones such as smartphones and electronic devices such as personal computers, miniaturization and performance enhancement are progressing. As electromagnetic wave shielding gaskets for such electronic devices, thinner conductive tapes that require high adhesion and good grounding properties are desired. [0003] Regarding the conventional conductive tape, as shown in Patent Document 1, for example, an adhesive layer in which a conductive filler is dispersed is laminated on both sides of a fabric s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/04C09J201/00H01B5/02H05K9/00C09J7/21
CPCB32B37/26Y10T428/1462H05K9/0009H05K9/009C09J2201/602C09J2201/32C09J2203/326C09J2400/163C09J2201/28Y10T428/2848C09J7/04C09J2201/622C09J7/21Y10T442/2418Y10T442/10Y10T442/109C09J2301/206C09J2301/204C09J2301/314C09J2301/312C09J201/00H01B5/02H05K9/00
Inventor 杉原茂一高木进斎木哲彦
Owner SEIREN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap