High-performance polyimide fiber reinforced epoxy resin composite material and preparation method thereof

A technology of polyimide fiber and epoxy resin, which is applied in the field of new epoxy resin composite materials and its preparation, can solve the problem of surface inertness and poor adhesion of thermosetting resin, poor resistance to ultraviolet radiation of aramid fiber, and limitation of aramid fiber. The use of weather resistance of fiber fibers and other issues, to achieve excellent mechanical properties, excellent comprehensive mechanical properties, the effect of large interaction force

Active Publication Date: 2013-11-27
BEIJING UNIV OF CHEM TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But there are also deficiencies. The main deficiencies of UHMWPE fiber are low melting point (about 130°C), easy creep, surface inertness and poor adhesion to thermosetting resins.
Aramid fiber has poor water resistance. In a wet environment, it will absorb some water (the moisture absorption rate can reach 7%). The presence of water makes the fiber structure loose. Water in the environment usually passes through the interface channel from the outer surface of the composite material. In

Method used

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  • High-performance polyimide fiber reinforced epoxy resin composite material and preparation method thereof
  • High-performance polyimide fiber reinforced epoxy resin composite material and preparation method thereof
  • High-performance polyimide fiber reinforced epoxy resin composite material and preparation method thereof

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Embodiment example 2

[0028] In order to more clearly illustrate the technical solutions and characteristics of the implementation cases of the present invention or the prior art, the present invention will be further elaborated below in conjunction with specific examples. Obviously, the described examples are only some of the examples of the present invention, not all of them. the embodiment. Based on the embodiments of the present invention, all implementation cases obtained by ordinary persons in the art without creative efforts belong to the protection scope of the present invention. The epoxy resin of the following examples is selected from bisphenol A type epoxy resin (DGEBA, such as grade E-44, E-51, etc.), polyfunctional glycidylamine resin (TGDDM, grade AG80, etc.), aliphatic glycidol Ester epoxy resin (DGEAC, brand TDE-85, etc.), the fiber volume fraction in the product obtained in the following examples is 50% ± 5%, and the fiber volume fraction in the final product can be controlled by ...

Embodiment 1

[0029] Example 1: Dissolve 35g of diaminodiphenylsulfone (DDS) in 80g of bisphenol A epoxy resin (E-51) at 100°C, then add 20g of polyethylene glycol diglycidyl ether and 1g of imidazole well mixed. Then the polyimide fiber (PI-Q) is continuously dipped and wound. The temperature of the resin glue solution is controlled at 40°C during dipping, and the wrapped fiber that has been dipped is vacuumed at 50°C for 20 minutes. Then put it into a concave-convex mold, pre-cure at 110°C for 2 hours, cure at 150°C for 2 hours, and post-cure at 200°C for 3 hours. The glass transition temperature of the composite material is 180°C, the interlaminar shear strength is 60MPa, and the bending strength is 650MPa.

Embodiment 2

[0030] Example 2: 40g diaminodiphenylmethane (DDM), 60g polyfunctional glycidylamine resin (AG80), 30g aliphatic glycidyl ester epoxy resin (TDE-85), 10g n-butyl base glycidyl ether (BGE), and then carry out continuous dipping and winding of polyimide fiber (PI-BIA). Vacuum down for 20min. Then put it into a concave-convex mold, pre-cure at 80°C for 2 hours, cure at 150°C for 4 hours, and post-cure at 180°C for 2 hours. The glass transition temperature of the composite material is 170°C, the interlaminar shear strength is 63MPa, and the bending strength is 690MPa.

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Abstract

The invention relates to a high-performance polyimide fiber reinforced epoxy resin composite material and a preparation method thereof, and belongs to the technical field of high-performance composite materials. The preparation method which selects a copolymerized high-performance polyimide fiber containing aromatic heterocyclic diamine as a reinforcement, an epoxy resin as a matrix material and an aromatic amine compound and imidazole compound mixture as an epoxy resin curing agent comprises the following steps: mechanically stirring the epoxy resin, the curing agent and a diluent at 40-120DEG C for uniform mixing; impregnating copolymerized high-performance polyimide in a resin glue solution at 40-80DEG C, evacuating at a temperature in a range of room temperature to 50DEG C for 10-60min, and carrying out curing heating in a die according to a curing program comprising the heat insulation at 80-110DEG C for 1-2h, the heat insulation at 120-160DEG C for 1-4h and the heat insulation at 170-200DEG C for 1-4h. The composite material has excellent comprehensive mechanical performances and an excellent interface adhesion strength.

Description

technical field [0001] The invention belongs to the technical field of high-performance composite materials, and in particular relates to a novel epoxy resin composite material with high-performance polyimide fibers as reinforcements and a preparation method thereof. Background technique [0002] High-performance fiber-reinforced epoxy resin composites have the advantages of high specific strength and specific stiffness, good fatigue fracture resistance, corrosion resistance, strong designability, good structural dimensional stability, and easy large-area integral molding. They are widely used in Aerospace, electronic power, pressure vessels, building reinforcement, sports equipment and other fields. Among them, epoxy resin as a matrix material is an excellent thermosetting resin with low shrinkage, good dimensional stability, and a wide range of system options, with good mechanical properties, electrical insulation properties, adhesive properties and chemical corrosion resi...

Claims

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Application Information

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IPC IPC(8): C08J5/04C08L63/00C08L63/02C08G73/10
Inventor 武德珍陈彬彬牛鸿庆田国峰齐胜利
Owner BEIJING UNIV OF CHEM TECH
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