Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device

Abstract

The present invention provides a resin composition comprising an epoxy resin monomer, a novolac resin containing a compound having the structural units represented by general formula (I), and a filler. The particle size distribution of the filler, measured by laser diffractometry, has peaks in the respective ranges of 0.01 [mu]m to less than 1 [mu]m, 1 [mu]m to less than 10 [mu]m, and 10 [mu]m to less than 100 [mu]m, and the filler contains boron nitride particles with particle sizes of 10 [mu]m to 100 [mu]m. In general formula (I), R1 represents an alkyl group, an aryl group or an aralkyl group, R2 and R3 independently represent a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, m represents an integer of 0 to 2, and n represents an integer of 1 to 7.

Description

technical field [0001] The present invention relates to a resin composition, a resin sheet, a cured resin sheet, a resin sheet laminate, a cured resin sheet laminate, a method for producing the same, a semiconductor device, and an LED device. Background technique [0002] As electronic devices using semiconductors advance in size, capacity, and performance, the amount of heat generated from semiconductors mounted at high density is increasing. For example, for the stable operation of semiconductor devices used in the central processing unit of personal computers and the motor control of electric vehicles, heat sinks and heat sinks are indispensable for heat dissipation, and materials that can balance insulation and thermal conductivity are required As a member that combines semiconductor devices with heat sinks, etc. [0003] In addition, generally, organic materials are widely used as insulating materials such as printed boards on which semiconductor devices and the like a...

AI Technical Summary

Problems solved by technology

Although these inorganic materials have high thermal conductivity, their insulation is hardly sufficient compared to organic materials, and materials that can achieve both high insulation and thermal conductivity are being sought.

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