Low temperature sintered microwave dielectric ceramic BiTiNbO6 and preparation method thereof

Abstract

The invention discloses a low temperature sintered microwave dielectric ceramic BiTiNbO6 and a preparation method thereof. The chemical formula of the low temperature sintered microwave dielectric ceramic is BiTiNbO6. The preparation method comprises the following steps: (1) weighing and mixing original powder, with purity above 99.9%, of Bi2O3, TiO2 and Nb2O5 according to the chemical formula BiTiNbO6; (2) carrying out wet ball milling on the raw material mixture obtained in the step (1) for 12 hours and presintering the powder in an atmosphere at 850 DEG C for 6 hours after drying the powder, wherein the solvent is distilled water; (3) adding a binder to the powder prepared in the step (2) and then granulating the mixture, then carrying out compression forming and finally sintering the product in an atmosphere at 910-940 DEG C for 4 hours, wherein a polyvinyl alcohol solution with mass concentration of 5% is adopted as the binder and the dosage of the binder is 3% of the total mass of the powder. The prepared ceramic is well sintered at 910-940 DEG C, has dielectric constant of 26-27 and quality factor (Qf) as high as 56000-71000GHz, has low temperature coefficient of resonance frequency, can be co-sintered with Ag electrodes at low temperature and has great application value in industry.

Description

technical field [0001] The invention relates to a dielectric ceramic material, in particular to a microwave dielectric ceramic material for microwave components used at microwave frequencies, such as a dielectric substrate, a resonator, and a filter, and a preparation method thereof. Background technique [0002] Microwave dielectric ceramics refer to ceramics that are used as dielectric materials in circuits in the microwave frequency band (mainly UHF and SHF bands) and perform one or more functions. They are widely used as resonators, filters, and dielectric substrates in modern communications. Components such as chips and dielectric waveguide circuits are the key basic materials of modern communication technology. They have been used in portable mobile phones, car phones, cordless phones, TV satellite receivers and military radars. They are used in modern communication tools. It is playing an increasingly important role in the process of miniaturization and integration. ...

AI Technical Summary

Problems solved by technology

In recent years, with the development of low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, LTCC) and the requirements of the development of microwave multilayer devices, researchers at home and abroad have carried out extensive exploration and research on some low-temperature co-fired materials, mainly The glass-ceramic or glass-ceramic composite material system is used. Because the low melting point glass phase has relatively high dielectric loss, the existence of the glass phase greatly improves the dielectric loss of the material.

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