Hydrous cutting fluid for slicing silicon ingot

A cutting fluid and slicing technology, applied in grinding/polishing equipment, base materials, stone processing equipment, etc., can solve the problems of silicon wafer surface flatness degradation and insufficient effect, and achieve excellent reaction inhibition and foam suppression Excellent performance and high cooling effect

Inactive Publication Date: 2014-01-08
SANYO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, there is a problem that the flatness of the silicon wafer surface generally deteriorates when the thickness of the silicon wafer is reduced or the slicing time is shortened.
[0010] Therefore, as a countermeasure, a method

Method used

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  • Hydrous cutting fluid for slicing silicon ingot
  • Hydrous cutting fluid for slicing silicon ingot

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0100] Manufacturing example 1

[0101] Add 92 parts of glycerin and 0.05 part of sodium hydroxide to a stainless steel pressurized reactor. After nitrogen replacement, 204 parts of ethylene oxide and 204 parts of propylene oxide are mixed at 120°C to 140°C for about 4 hours. Hydraulic indentation.

[0102] It was further reacted at this temperature for 10 hours to obtain the EO-PO random adduct (A-1) of glycerol of the present invention (f=3; m=2.8; n=1.6; k=1.2; n / (n+ k)=0.57; the number average molecular weight is 500; HLB=17.5).

[0103] In addition, the number average molecular weight is the molecular weight obtained by gel permeation chromatography (GPC).

Example Embodiment

[0104] Manufacturing example 2

[0105] In Production Example 1, except that glycerin was set to 29 parts, ethylene oxide was set to 238 parts, and propylene oxide was set to 238 parts, the same operations as those in Production Example 1 were performed to obtain the present invention. EO-PO random adduct of glycerol (A-2) (f=3; m=12.0; n=5.7; k=4.3; n / (n+k)=0.57; number average molecular weight is 1,600; HLB= 13.3).

Example Embodiment

[0106] Manufacturing example 3

[0107] In Production Example 1, except that glycerin was set to 16.4 parts, ethylene oxide was set to 241 parts, and propylene oxide was set to 241 parts, the same operations as in Production Example 1 were performed to obtain the present invention. EO-PO random adduct of glycerol (A-3) (f=3; m=18.1; n=10.3; k=7.8; n / (n+k)=0.57; number average molecular weight is 2,800; HLB= 12.6).

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Abstract

The present invention provides a cutting fluid which, in the step of cutting a silicon ingot, is superior to conventional products in the removal of processing heat, infiltrating property, inhibition of reaction between water and the silicon, and antifoaming property to thereby attain an improvement in cutting efficiency, and with which silicon wafers having satisfactory flatness are yielded. The accuracy of the processed surface can hence be kept high even under severe slicing conditions. The cutting fluid is a hydrous cutting fluid for silicon-ingot slicing, characterized by comprising a polyoxyalkylene adduct (A) of a compound (a) having 3-8 hydroxy groups, the adduct (A) being represented by general formula (1), and water as essential components, the polyoxyalkylene adduct (A) having an HLB of 6.0-20.0. R{O-(A1O)m-H}f (1) [In formula (1), R represents the residue formed by removing the hydroxyl groups from a compound having 3-8 hydroxy groups; (A1O) represents a C2-4 oxyalkylene; m, indicating the average number of moles of a C2-4 alkylene oxide which has added, is a number of 1-350; and f is an integer of 3-8.]

Description

technical field [0001] The invention relates to an aqueous cutting fluid used in cutting silicon ingots. More specifically, the present invention relates to an aqueous cutting fluid having high cooling performance, excellent permeability, inhibition of reaction between silicon and water, foam suppression, and flatness of silicon wafers. Background technique [0002] Slicing methods for slicing silicon ingots using wires are roughly classified into: (1) methods using abrasive slurry (slurry), which is formed by dispersing free abrasive particles in cutting fluid; And (2) a method using a fixed abrasive wire formed by fixing abrasive grains to the wire by electroplating or bonding with a resin, and an aqueous cutting fluid. [0003] In recent years, with regard to the aqueous cutting fluid used in the slicing method using fixed abrasive wires, in order to improve the cooling performance of the frictional heat generated during cutting, or to reduce the risk of ignition caused ...

Claims

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Application Information

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IPC IPC(8): C10M173/02B28D5/04H01L21/304C10N30/04C10N30/18C10N40/22
CPCC10N2220/021C10M2209/104C10N2240/50C10M173/02C10N2020/04C10N2040/32C10M2209/105B24B27/06C10M107/34H01L21/304
Inventor 福岛刚胜川吉隆山下圣二
Owner SANYO CHEM IND LTD
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