Dental implant
A technology for dental implants and implants, applied in dentistry, dental implants, dental prosthetics, etc., can solve the problems of weakening the bonding ability of implants and surrounding connective tissue, adverse patient recovery, and adhesion of surrounding bacteria, and achieves the promotion of platelets. Adhesion and activation, accelerates good healing, prevents bacterial invasion
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[0023] Embodiment 1, using photolithography technology to design a mask with the same width and spacing as the etched trenches, control the width and spacing of the trenches on the silicon plate through the mask, and control the depth of the trenches on the silicon plate through the etching time. There are multiple micro grooves evenly distributed on the surface of the smooth collar of the implant: width 60μm, groove spacing 60μm, depth 10μm, the longitudinal section of the groove is inverted trapezoid, the angle between the sidewall of the groove and the surface of the collar is 54.74 °, spray a 200nm titanium (Ti) coating on the surface of the trench by magnetron sputtering technology.
Example Embodiment
[0024] Embodiment 2, using photolithography technology to design a mask with the same width and spacing as the etched trenches, control the width and spacing of the trenches on the silicon plate through the mask, and control the depth of the trenches on the silicon plate through the etching time. There are multiple micro grooves evenly distributed on the surface of the smooth collar of the implant: width 60μm, groove spacing 60μm, depth 10μm, the longitudinal section of the groove is inverted trapezoid, the angle between the sidewall of the groove and the surface of the collar is 54.74 °, sputter a 200nm titanium nitride (TiN) coating on the trench surface by magnetron sputtering technology.
Example Embodiment
[0025] In Embodiment 3, photolithography is used to design a mask with the same width and spacing as the etched trenches. The width and spacing of the trenches on the silicon plate are controlled by the mask, and the depth of the trenches on the silicon plate is controlled by the etching time. There are multiple micro grooves evenly distributed on the surface of the smooth collar of the implant: width 50μm, groove spacing 100μm, depth 13μm, the longitudinal section of the groove is inverted trapezoid, the angle between the sidewall of the groove and the surface of the collar is 54.74 °, using magnetron sputtering technology to sputter 300nm titanium nitride (TiN) coating on the trench surface.
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