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A chemical vapor deposition equipment for producing silicon carbide epitaxial wafers

A technology of chemical vapor deposition and epitaxial wafers, applied in the direction of chemically reactive gases, chemical instruments and methods, single crystal growth, etc., can solve the problems of uniformity and surface defects, thick silicon carbide epitaxial layer, low growth rate, etc. Achieve simple cost input, reduce thickness difference, and good stability

Active Publication Date: 2016-08-10
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like figure 1 In the traditional horizontal vapor deposition equipment shown, during the epitaxial growth, because the reaction gas source passes through the reaction chamber during the reaction process, there is a "depletion" phenomenon, that is, when the reaction gas flows parallel to the substrate, the inflow of the gas flow The concentration in the direction is higher, because the "consumption" phenomenon has a smaller concentration in the outflow direction of the airflow, so the epitaxial layer on the substrate surface close to the inflow direction of the airflow will be thicker and the epitaxial layer in the outflow direction of the airflow will be thinner
This non-uniformity has a great impact on device fabrication, especially for thicker epitaxial layers
[0004] The patent number is ZL98812328.2, and the patent titled "Growing very uniform silicon carbide epitaxial layer" discloses an improved chemical vapor deposition method. The reactor is heated until the silicon carbide raw material gas forms an epitaxial layer on the substrate in the reactor. The temperature of the raw material gas and the carrier gas flow through the heated reactor to form a silicon carbide epitaxial layer on the substrate. At the same time, the carrier gas includes a mixture of hydrogen and a second gas, wherein the thermal conductivity of the second gas is lower than that of hydrogen. lead, so that the consumption of the raw material gas when passing through the reactor is lower than that of using a single hydrogen as the carrier gas, but the operation process is complicated, and an additional gas source is added, which increases the manufacturing cost
In recent years, silicon carbide epitaxy technology has been very mature in low-voltage devices, but there are still many shortcomings in silicon carbide thick epitaxy technology in high-voltage devices, such as the difficulty of achieving thicker silicon carbide epitaxial layers due to uniformity and surface defects; The growth rate is too low, making the thick SiC epiwafers required to grow high-voltage devices prohibitively expensive

Method used

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  • A chemical vapor deposition equipment for producing silicon carbide epitaxial wafers
  • A chemical vapor deposition equipment for producing silicon carbide epitaxial wafers
  • A chemical vapor deposition equipment for producing silicon carbide epitaxial wafers

Examples

Experimental program
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Embodiment 1

[0028] Such as image 3 As shown, the arc of the barrier ring is 180 degrees, the width is 0.9 cm, and the height is 0.4 cm. Through the above process, the growth of the epitaxial wafer is completed. In the direction of the corresponding gas flow of the silicon carbide substrate, 10 points were measured at intervals, point 1 corresponds to the upper side of the gas flow, and point 10 corresponds to the lower side of the gas flow, and the measurement results are as follows Figure 5 As shown, the thickness of the silicon carbide epitaxial wafer obtained in Example 1 was reduced from 2.13% to 0.97%.

Embodiment 2

[0030] Such as Figure 4 As shown, when the radian of the barrier ring is 90 degrees, the width is 1.0 cm, and the set height is 0.5 cm, the growth of the epitaxial wafer is completed through the above process flow. In the direction of the corresponding gas flow of the silicon carbide substrate, 10 points were measured at intervals, point 1 corresponds to the upper side of the gas flow, and point 10 corresponds to the lower side of the gas flow, and the measurement results are as follows Figure 6 As shown, the thickness uniformity of the silicon carbide epitaxial wafer obtained in Example 2 was reduced from 2.13% to 1.19%.

Embodiment 3

[0032] The width of the graphite barrier ring is 0.8 cm, the height is 0.3 cm, the radius is 1 cm larger than the width of the substrate wafer, and the thickness uniformity of the epitaxial wafer obtained when the arc is 100 degrees is reduced from 2.16% to 1.21%.

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Abstract

The invention provides a method for improving the uniformity of silicon carbide epitaxial wafers, which can be used to grow silicon carbide epitaxial wafers with uniform thickness. By installing a gas flow blocking ring under the gas flow in the reaction chamber, and then placing the silicon carbide substrate on the support table, heating the reaction chamber to the temperature required for epitaxy, passing the reaction gas and carrier gas, and finally on the silicon carbide substrate A silicon carbide epitaxial layer is formed on the bottom. The thickness of the silicon carbide epitaxial wafer obtained by the invention is more uniform, and the device is simple, which is the most feasible and cheapest method for improving traditional equipment, does not require excessive cost input, and is beneficial to industrial production.

Description

【Technical field】 [0001] The invention belongs to the field of chemical vapor deposition, and in particular relates to a chemical vapor deposition equipment for producing silicon carbide epitaxial wafers. 【Background technique】 [0002] Silicon carbide (SiC) is the third-generation wide-bandgap semiconductor material. It has the characteristics of wide bandgap, high critical breakdown electric field, high thermal conductivity, and high carrier saturation drift velocity. It is especially suitable for high-temperature, high-voltage, and high-power power electronics. Semiconductor devices such as semiconductors are of great significance to the development of industries such as hybrid electric vehicles, electric vehicles, solar inverters, and smart grids. [0003] The production of silicon carbide materials, whether it is crystal growth or epitaxial growth, is not easy, and growing high-quality epitaxial wafers is a challenge to the process. The reaction chamber, the cleanlines...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/36C30B25/20C30B25/10C30B25/14
Inventor 钮应喜杨霏于坤山
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD