A chemical vapor deposition equipment for producing silicon carbide epitaxial wafers
A technology of chemical vapor deposition and epitaxial wafers, applied in the direction of chemically reactive gases, chemical instruments and methods, single crystal growth, etc., can solve the problems of uniformity and surface defects, thick silicon carbide epitaxial layer, low growth rate, etc. Achieve simple cost input, reduce thickness difference, and good stability
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Embodiment 1
[0028] Such as image 3 As shown, the arc of the barrier ring is 180 degrees, the width is 0.9 cm, and the height is 0.4 cm. Through the above process, the growth of the epitaxial wafer is completed. In the direction of the corresponding gas flow of the silicon carbide substrate, 10 points were measured at intervals, point 1 corresponds to the upper side of the gas flow, and point 10 corresponds to the lower side of the gas flow, and the measurement results are as follows Figure 5 As shown, the thickness of the silicon carbide epitaxial wafer obtained in Example 1 was reduced from 2.13% to 0.97%.
Embodiment 2
[0030] Such as Figure 4 As shown, when the radian of the barrier ring is 90 degrees, the width is 1.0 cm, and the set height is 0.5 cm, the growth of the epitaxial wafer is completed through the above process flow. In the direction of the corresponding gas flow of the silicon carbide substrate, 10 points were measured at intervals, point 1 corresponds to the upper side of the gas flow, and point 10 corresponds to the lower side of the gas flow, and the measurement results are as follows Figure 6 As shown, the thickness uniformity of the silicon carbide epitaxial wafer obtained in Example 2 was reduced from 2.13% to 1.19%.
Embodiment 3
[0032] The width of the graphite barrier ring is 0.8 cm, the height is 0.3 cm, the radius is 1 cm larger than the width of the substrate wafer, and the thickness uniformity of the epitaxial wafer obtained when the arc is 100 degrees is reduced from 2.16% to 1.21%.
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Abstract
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