Ceramic bond, preparation method thereof and manufacturing method of ceramic bond grinding tool

Abstract

The invention relates to a ceramic bond with low refractoriness and high strength. The ceramic bond comprises the following components in percentage by weight: 25%-45% of silicon dioxide, 15%-25% of ultrafine silicon dioxide with the particle size of not more than 5 microns, 14%-20% of sodium tetraborate, 8%-13% of aluminum oxide, 4%-8% of lithium carbonate, 5%-10% of zinc oxide, 1%-2% of magnesium oxide, 0%-1% of barium carbonate and 3%-5% of titanium oxide. As the ultrafine silicon dioxide is introduced into the component, the strength of the ceramic bond is improved and the refractoriness is simultaneously reduced. In addition, the invention further provides a preparation method of the ceramic bond and a method for manufacturing a ceramic bond grinding tool by utilizing the ceramic bond.

Description

technical field [0001] The invention relates to a bonding agent for an abrasive tool, a preparation method and a manufacturing method of the abrasive tool, in particular to a vitrified bond, a preparation method and a manufacturing method for a vitrified bonded abrasive tool. Background technique [0002] Abrasives are tools used for grinding, grinding and polishing. Most of them are made of abrasives and bonding agents. The bonding agents commonly used in the manufacture of abrasive tools include resin bonds, metal bonds and vitrified bonds. Compared with the vitrified bond and metal bond, the abrasive tool made of vitrified bond has strong grinding ability, high durability, good shape retention of the abrasive tool during grinding, high dimensional accuracy of the processed parts, and good self-sharpening performance. , The trimming interval is long, and it is suitable for cooling with various coolants. [0003] At present, the vitrified binder system mainly includes B-Zn...

AI Technical Summary

Problems solved by technology

Especially the diamond vitrified bond, since the diamond begins to lose thermal weight at 800 degrees Celsius, the sintering temperature of the diamond abrasive generally does not exceed 850 degrees Celsius, otherwise the diamond will destroy the grinding ability of the diamond abrasive due to the thermal weightlessness. According to the requirements of sintering temperature, the refractoriness of diamond ceramic bond should be lower than 800 degrees Celsius. To solve this problem, the existing technology mainly reduces the refractoriness of diamond ceramic bond by introducing a large amount of alkaline substances, but it will also reduce the Vitrified bond strength

[0004] The preparation method of the existing ceramic bond includes batching steps, mixing steps, smelting steps, water quenching steps, crushing steps, drying steps and sieving steps. Before the water quenching step, that is, in the smelting step, the raw materials need to be heated to 1300 Melting is carried out at -1400 degrees Celsius, and then it must be put into water for water quenching. During this process, alkaline substances will be heated and volatilized, which will affect the stability of the refractoriness, low thermal expansion coefficient, and strength of the prepared vitrified bond.

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