Thermal curing type printless organic silicon pressure-sensitive adhesive tape and preparation method thereof

A technology of silicone pressure-sensitive adhesive and silicon pressure-sensitive tape, which is applied in the direction of adhesives, film/sheet adhesives, coatings, etc., and can solve the problems of corrosion of the attached object, difficulty in dispersing, and high cost.

Inactive Publication Date: 2014-03-12
SUZHOU BANLID NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of addition-type silicone pressure-sensitive tape are: 1. The glue is expensive; 2. Use expensive organoplatinum catalysts; 3. It is easily affected by halogen-containing, phosphorus-containing, amines, sulfur and heavy metal impurities in the environment. Catalyst poisoning and failure caused by the impact, the production environment and production equipment requirements are very strict; therefore, the use of addition-type silicone pressure-sensitive tape is not widely used, and the production efficiency is not high
[0006] The disadvantage of heat-curing silicone tape is that during the vulcanization process of polysiloxane, the small molecule benzoic acid decomposed by the vulcanizing agent has a strong acidity, which is very easy to corrode the substrate and leave scratches on the substrate. indelible marks
The current direction of research on non-marking tapes is to add alkaline sub...

Method used

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  • Thermal curing type printless organic silicon pressure-sensitive adhesive tape and preparation method thereof
  • Thermal curing type printless organic silicon pressure-sensitive adhesive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 and as figure 2 As shown, a heat-curable non-marking silicone pressure-sensitive adhesive tape includes a base material layer 1 and a silicone pressure-sensitive adhesive layer 3 formed by coating a silicone pressure-sensitive adhesive, on the base material layer 1 and the silicone pressure-sensitive adhesive layer 3 are provided with a primer layer 2 formed by coating a primer; the silicone pressure-sensitive adhesive includes parts by weight of 100 parts of silicone pressure-sensitive adhesive, 30 The toluene of part, the benzoyl peroxide of 0.5 part and shadow remover; Described shadow remover quality accounts for 70% of described benzoyl peroxide quality; Described priming agent comprises the Dow that weight part is 100 parts 7499 primer, 1.4 parts 7367 bridging agent, 0.5 parts 4000 catalyst and 500 parts of toluene. In this technical solution, the image remover is a metal alkoxide or a weak acid salt.

[0041] The present invention also p...

Embodiment 2

[0055] The rest are the same as the above-mentioned embodiments, except that a heat-curable non-marking silicone pressure-sensitive adhesive tape includes a substrate layer 1 and a silicone pressure-sensitive adhesive layer formed by coating a silicone pressure-sensitive adhesive 3. An undercoat layer 2 formed by coating a primer is provided between the substrate layer 1 and the silicone pressure-sensitive adhesive layer 3; the silicone pressure-sensitive adhesive includes parts by weight of 100 parts of silicone pressure-sensitive adhesive, 100 parts of toluene, 3 parts of benzoyl peroxide and a shadow remover; the quality of the shadow remover accounts for 230% of the quality of the benzoyl peroxide; the primer Including 100 parts by weight of Dow 7499 primer, 1.4 parts 7367 bridging agent, 0.5 parts 4000 catalyst and 2000 parts of toluene.

[0056] The present invention also provides a method for making a heat-curing non-marking silicone pressure-sensitive adhesive ta...

Embodiment 3

[0065] The rest are the same as the above-mentioned embodiments, except that a heat-curable non-marking silicone pressure-sensitive adhesive tape includes a substrate layer and a silicone pressure-sensitive adhesive layer formed by coating a silicone pressure-sensitive adhesive, Between the substrate layer and the silicone pressure-sensitive adhesive layer, there is a primer layer formed by coating a primer; the silicone pressure-sensitive adhesive includes 100 parts by weight of silicone pressure-sensitive adhesive. Sensitive glue, 60 parts of toluene, 1.5 parts of benzoyl peroxide and shadow remover; described shadow remover quality accounts for 150% of described benzoyl peroxide quality; described primer includes weight parts and is 100% portion of Dow 7499 primer, 1.4 parts 7367 bridging agent, 0.5 parts 4000 catalyst and 1200 parts of toluene.

[0066] Preferably, the image remover is a metal alkoxide or a weak acid salt.

[0067] The present invention also provide...

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Abstract

A disclosed thermal curing type printless organic silicon pressure-sensitive adhesive tape comprises a base material layer and an organic silicon pressure-sensitive glue layer by coating with an organic silicon pressure-sensitive glue, and a primer layer is arranged between the base material layer and the organic silicon pressure-sensitive glue layer by coating with a primer; the organic silicon pressure-sensitive glue comprises, in parts by weight, 100 parts of the organic silicon pressure-sensitive glue, 30-100 parts of toluene, 0.5-3 parts of benzoyl peroxide and a shadow-removing agent accounting for 70%-230% by mass of benzoyl peroxide; and the primer comprises, in parts by weight, 100 parts of a primer, 1.4 parts of a bridging agent and 500-2000 parts of toluene. According to the thermal curing type printless organic silicon pressure-sensitive adhesive tape and a preparation method thereof both provided by the invention, the preparation process is simple, the cost is low, no corrosion is generated on a pasted object and no difficult-to-removed prints are generated, so that the bad appearance of the pasted object is avoided.

Description

technical field [0001] The invention relates to the technical field of pressure-sensitive adhesive tapes, in particular to a thermosetting non-marking silicone pressure-sensitive adhesive tape and a manufacturing method thereof. Background technique [0002] Silicone pressure-sensitive tape has excellent high / low temperature resistance and aging resistance, has the characteristics of low surface free energy, and can stick to the surface of difficult-to-stick objects, so it is widely used. [0003] At present, there are two types of silicone adhesives for making silicone pressure-sensitive tapes: addition type and heat curing type; [0004] The addition type uses unsaturated silicone pressure-sensitive adhesives containing vinyl structures, and under the catalysis of organoplatinum catalysts, small molecule polysiloxanes containing active hydrogen structures are used as cross-linking agents to cross-link at a certain temperature and for a certain time. Silicone pressure-sens...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J183/04C09D201/00C09D7/12
Inventor 潘成诚
Owner SUZHOU BANLID NEW MATERIAL
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