Thermal curing type printless organic silicon pressure-sensitive adhesive tape and preparation method thereof

Abstract

A disclosed thermal curing type printless organic silicon pressure-sensitive adhesive tape comprises a base material layer and an organic silicon pressure-sensitive glue layer by coating with an organic silicon pressure-sensitive glue, and a primer layer is arranged between the base material layer and the organic silicon pressure-sensitive glue layer by coating with a primer; the organic silicon pressure-sensitive glue comprises, in parts by weight, 100 parts of the organic silicon pressure-sensitive glue, 30-100 parts of toluene, 0.5-3 parts of benzoyl peroxide and a shadow-removing agent accounting for 70%-230% by mass of benzoyl peroxide; and the primer comprises, in parts by weight, 100 parts of a primer, 1.4 parts of a bridging agent and 500-2000 parts of toluene. According to the thermal curing type printless organic silicon pressure-sensitive adhesive tape and a preparation method thereof both provided by the invention, the preparation process is simple, the cost is low, no corrosion is generated on a pasted object and no difficult-to-removed prints are generated, so that the bad appearance of the pasted object is avoided.

Description

technical field [0001] The invention relates to the technical field of pressure-sensitive adhesive tapes, in particular to a thermosetting non-marking silicone pressure-sensitive adhesive tape and a manufacturing method thereof. Background technique [0002] Silicone pressure-sensitive tape has excellent high / low temperature resistance and aging resistance, has the characteristics of low surface free energy, and can stick to the surface of difficult-to-stick objects, so it is widely used. [0003] At present, there are two types of silicone adhesives for making silicone pressure-sensitive tapes: addition type and heat curing type; [0004] The addition type uses unsaturated silicone pressure-sensitive adhesives containing vinyl structures, and under the catalysis of organoplatinum catalysts, small molecule polysiloxanes containing active hydrogen structures are used as cross-linking agents to cross-link at a certain temperature and for a certain time. Silicone pressure-sens...

AI Technical Summary

Problems solved by technology

The disadvantages of addition-type silicone pressure-sensitive tape are: 1. The glue is expensive; 2. Use expensive organoplatinum catalysts; 3. It is easily affected by halogen-containing, phosphorus-containing, amines, sulfur and heavy metal impurities in the environment. Catalyst poisoning and failure caused by the impact, the production environment and production equipment requirements are very strict; therefore, the use of addition-type silicone pressure-sensitive tape is not widely used, and the production efficiency is not high

[0006] The disadvantage of heat-curing silicone tape is that during the vulcanization process of polysiloxane, the small molecule benzoic acid decomposed by the vulcanizing agent has a strong acidity, which is very easy to corrode the substrate and leave scratches on the substrate. indelible marks

The current direction of research on non-marking tapes is to add alkaline substances to silicone pressure-sensitive adhesives, and to obtain non-marking tapes by neutralizing the degradation products of the vulcanizing agent with these basic substances; but common alkaline substances They are all highly polar substances, which are difficult to disperse into adhesives with very small surface free energy, so the effect is not good; organic amines can be well dispersed into silicone adhesive systems, but organic amines are very It is easy to react with the silicon hydroxyl group in the silicone adhesive molecule to cause the gel of the adhesive system; another research direction of non-marking tape is to bake the vulcanized tape under negative pressure conditions above 160°C for a long time, so that The small molecule benzoic acid in the adhesive layer will slowly volatilize, but such a high temperature will cause serious consumption of heat and deformation and deterioration of the tape

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