A medicament for separating silicon carbide in mortar
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 安徽苏源光伏科技有限公司
- Publication Date
- 2016-02-10
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention relates to a powder separation technology for silicon and silicon carbide in mortar produced by a silicon wafer wire sawing process, in particular to a medicament for separating silicon carbide in mortar and a preparation method thereof. Background technique
[0002] Various silicon wafers, including monocrystalline silicon and polycrystalline silicon solar cells, and silicon wafers for the microelectronics industry, are generally produced by cutting with wire saws and silicon carbide abrasive slurry, referred to as mortar. The thickness of the silicon wafer is generally 0.22mm, and there is no development trend of thinning at present. The width of the wire saw kerf is generally 0.18-0.30mm, which means that 20-60% of the high-purity silicon material will enter the mortar as sawdust, and its extraction Recycling is equivalent to opening up a new and sizable source of high-purity silicon raw materials.
[0003] Although the benefits of re...