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149results about How to "Overcome the small stiffness" patented technology

Thermoset particles with enhanced crosslinking, processing for their production, and their use in oil and natural gas driliing applications

Thermoset polymer particles are used in many applications requiring lightweight particles possessing high stiffness, strength, temperature resistance, and/or resistance to aggressive environments. The present invention relates to the use of methods to enhance the stiffness, strength, maximum possible use temperature, and environmental resistance of such particles. One method of particular interest is the application of post-polymerization process step(s) (and especially heat treatment) to advance the curing reaction and to thus obtain a more densely crosslinked polymer network. The most common benefits of said heat treatment are the enhancement of the maximum possible use temperature and the environmental resistance. The present invention also relates to the development of thermoset polymer particles. It also relates to the further improvement of the key properties (in particular, heat resistance and environmental resistance) of said particles via post-polymerization heat treatment. Furthermore, it also relates to processes for the manufacture of said particles. Finally, it also relates to the use of said particles in the construction, drilling, completion and/or fracture stimulation of oil and natural gas wells; for example, as a proppant partial monolayer, a proppant pack, an integral component of a gravel pack completion, a ball bearing, a solid lubricant, a drilling mud constituent, and/or a cement additive.
Owner:SUN DRILLING PRODS

LED device and manufacturing method thereof

In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package. Hence, when the LED device is soldered onto a mount board, solder is deposited even on the up-bent tips of the leads, so that surface tension of solder is balanced on the front and rear of the package. As a result, the LED device can be mounted in a predetermined position while prevented from sliding. In an LED lead frame, hanger leads are provided so as to be extended in three directions of a package. Hence, the electrically conductive leads can be bent stably and accurately without tottering of the package in the process of bending the electrically conductive leads.
Owner:TOYODA GOSEI CO LTD +1
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