Epoxy molding compound filled with high amount of silica powder and preparation method thereof

A technology of epoxy molding compound and silicon micropowder, which is applied in the field of epoxy molding compound and its preparation, can solve problems such as difficulty in adapting to small-profile packaging structures, increased melt viscosity, and affecting processing and molding, and achieves good strength and reduced porosity , Easy to shape and process

Active Publication Date: 2014-03-26
WUXI CHUANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above properties can be improved by increasing the content of inorganic fillers in epoxy molding compounds, but too much inorganic fillers will increase the melt viscosity of epoxy moldi

Method used

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  • Epoxy molding compound filled with high amount of silica powder and preparation method thereof
  • Epoxy molding compound filled with high amount of silica powder and preparation method thereof
  • Epoxy molding compound filled with high amount of silica powder and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0033] First, pulverize the epoxy resin and curing agent to obtain particles with a particle size of less than 3 mm, and then weigh the components according to the proportions in the table below. Heat-melted and mixed uniformly at ~110 ℃, solid flakes are obtained after cooling, pulverized and sieved to obtain particles with a particle size of less than 4 mm, and the pulverized materials are packaged directly or after beating.

[0034]

[0035] The above raw material components are all by weight.

[0036] The epoxy molding compounds obtained from the examples in the table above have been tested and have the technical effects shown in the table below:

[0037] component specific substance Example 1 Example 2 Example 3 epoxy resin o-Cresol Novolac Epoxy Resin 77 70 70 epoxy resin Epoxy resin containing biphenyl structure 23 28 30 Hardener novolac resin 47.5 49 50 Hardener xylok phenolic resin 2.5 3.5 5 curing acceler...

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Abstract

The invention discloses an epoxy molding compound filled with a high amount of silica powder and a preparation method thereof. The epoxy molding compound comprises the following raw material components by weight percent: 5.0-9.0% of epoxy resin, 3.1-5.0% of a curing agent, 0.4-1.0% of a curing accelerator, 80-90% of silica powder, 0.5-2.0% of a fire retardant, 0.5-1.5% of a coupling reagent, and 0.5-1.5% of a releasing agent. The preparation method comprises the following steps: smashing resin, weighing and uniformly mixing all the components according to the proportion, adding the components into an extruding machine to be smelted for mixing, cooling, smashing, and packaging. The epoxy molding compound has the advantages that the silicon powder filling amount of the epoxy molding compound is relatively high and the mobility is relatively good, has the characteristics of high mechanical strength, low thermal expansion coefficient and low water absorption, can reach the inflaming retarding standard of a UL-94V-0 level, and meets the environmental requirement for halogen and antimony prevention.

Description

technical field [0001] The invention relates to an epoxy molding compound for semiconductor encapsulation and a preparation method thereof, in particular to an epoxy molding compound with high filling of silicon micropowder and a preparation method thereof. Background technique [0002] Epoxy molding compound has been widely used in various packaging fields such as semiconductor devices, integrated circuits, consumer electronics, and automotive electronics due to its high reliability, low cost, simple production process, and suitability for mass production. status. [0003] With the development of electronic products towards high performance, multi-function, miniaturization and portability, higher requirements are also placed on electronic packaging materials, such as low expansion coefficient, low dielectric constant, high mechanical strength and extremely low water absorption. The above properties can be improved by increasing the content of inorganic fillers in the epoxy...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08L63/00C08K7/18C08K3/36C08K3/38C08G59/62
Inventor 翁根元刘娜
Owner WUXI CHUANGDA ELECTRONICS
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