Epoxy molding compound filled with high amount of silica powder and preparation method thereof

Abstract

The invention discloses an epoxy molding compound filled with a high amount of silica powder and a preparation method thereof. The epoxy molding compound comprises the following raw material components by weight percent: 5.0-9.0% of epoxy resin, 3.1-5.0% of a curing agent, 0.4-1.0% of a curing accelerator, 80-90% of silica powder, 0.5-2.0% of a fire retardant, 0.5-1.5% of a coupling reagent, and 0.5-1.5% of a releasing agent. The preparation method comprises the following steps: smashing resin, weighing and uniformly mixing all the components according to the proportion, adding the components into an extruding machine to be smelted for mixing, cooling, smashing, and packaging. The epoxy molding compound has the advantages that the silicon powder filling amount of the epoxy molding compound is relatively high and the mobility is relatively good, has the characteristics of high mechanical strength, low thermal expansion coefficient and low water absorption, can reach the inflaming retarding standard of a UL-94V-0 level, and meets the environmental requirement for halogen and antimony prevention.

Description

technical field [0001] The invention relates to an epoxy molding compound for semiconductor encapsulation and a preparation method thereof, in particular to an epoxy molding compound with high filling of silicon micropowder and a preparation method thereof. Background technique [0002] Epoxy molding compound has been widely used in various packaging fields such as semiconductor devices, integrated circuits, consumer electronics, and automotive electronics due to its high reliability, low cost, simple production process, and suitability for mass production. status. [0003] With the development of electronic products towards high performance, multi-function, miniaturization and portability, higher requirements are also placed on electronic packaging materials, such as low expansion coefficient, low dielectric constant, high mechanical strength and extremely low water absorption. The above properties can be improved by increasing the content of inorganic fillers in the epoxy...

AI Technical Summary

Problems solved by technology

The above properties can be improved by increasing the content of inorganic fillers in epoxy molding compounds, but too much inorganic fillers will increase the melt viscosity of epoxy molding compounds, reduce fluidity, affect processing and molding, and make it difficult to adapt to small shapes and high densities. (multi-layer, multi-pin, fine-pitch, etc.) package structure

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