Preparation method for electromagnetic shielding silicone rubber
An electromagnetic shielding and silicone rubber technology is applied in the field of preparation of electromagnetic shielding silicone rubber, which can solve the problems of affecting the electrical conductivity and magnetic permeability of silicone rubber, being expensive, and having no catalytic activity.
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[0026] The embodiment of the present invention discloses a preparation method of electromagnetic shielding silicone rubber, comprising the following steps:
[0027] Mixing disodium edetate solution with sodium potassium tartrate solution to obtain a first mixed solution;
[0028] Mixing a solution containing divalent nickel ions with the first mixed solution to obtain a second mixed solution;
[0029] Mixing the second mixed solution with the hydrazine solution to obtain a third mixed solution;
[0030] Copper powder is mixed with the third mixed solution to obtain nickel-plated copper powder after reaction;
[0031] The raw silicone rubber, the vulcanizing agent and the nickel-plated copper powder are sequentially banburyed and vulcanized to obtain the electromagnetic shielding silicone rubber.
[0032] In order to prepare electromagnetic shielding silicone rubber materials, the application uses nickel-plated copper powder as the filler of silicone rubber, so the applicatio...
Embodiment 1
[0052] Dissolve 24g EDTA-2Na in 300ml of water, dissolve 18g potassium sodium tartrate in 100ml of water; weigh 27gNiSO 4 ·6H 2 Dissolve O in 100ml of water; measure 80ml of N 2 h 2 ·H 2 O was diluted with 100ml of water. Mix the first two solutions and adjust the pH to 7.5 with ammonia water, then slowly add the hydrazine solution, stir rapidly when adding, adjust the pH to about 12.5 with 1.0mol / L sodium hydroxide, add water until the solution is close to 1L, and use 0.1mol / L sodium hydroxide solution to adjust the pH to 13, then add water to 1L to obtain a plating solution. Heat the plating solution in a water bath to 85°C. When the temperature rises to 75°C, add 25g of copper powder under rapid stirring, and continue stirring until the red color disappears. When the temperature rises to 85°C, keep it warm for 1 hour. Filter the copper powder and wash it with water until neutral. Rinse twice with acetone and dry at low temperature to obtain nickel-plated copper powder...
Embodiment 2
[0055] Dissolve 35g EDTA-2Na in 350ml water, dissolve 15g sodium potassium tartrate in 100ml water; weigh 40gNiSO 4 ·6H 2 Dissolve O in 150ml water, measure N 2 h 2 ·H 2 Dilute O100ml with 100ml of water. Mix the first two solutions and adjust the pH to 7.5 with ammonia water, then slowly add the hydrazine solution, stir rapidly when adding, adjust the pH to about 13 with 1.0mol / L sodium hydroxide, add water until the solution is close to 1L, and use 0.1mol / L sodium hydroxide solution to adjust the pH to 13.5, then add water to 1L to obtain a plating solution. Heat the plating solution in a water bath to 80°C. When the temperature rises to 70°C, add 25g of copper powder under rapid stirring, and continue stirring until the red color disappears. When the temperature rises to 80°C, keep it warm for 1 hour. Filter the copper powder and wash it with water until neutral. Rinse twice with acetone and dry at low temperature to obtain nickel-plated copper powder.
[0056] Set t...
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