Integration method of high-density thick-film hybrid integrated circuit without lead ball

Abstract

The invention discloses an integration method of a surface-mounted high-density thick-film hybrid integrated circuit without lead ball pins. The method is adopted on a ceramic substrate, and the external connection end of the thick-film hybrid integrated circuit is directly made on the bottom surface of the ceramic substrate, and connected externally. The end is a metal spherical type; hybrid integration is carried out on the front of the ceramic substrate, and the thick film conduction band, thick film stop band, thick film capacitor, thick film inductor, etc. are sealed and insulated with an insulating medium thick film; the semiconductor bare chip Use insulating dielectric slurry for coating and curing protection; use three-dimensional (3D) vertical stacking method for integration to improve integration density. The characteristics of this method are: ①The volume is greatly reduced; ②The high-frequency interference is reduced; ③The length of the conduction band is reduced, and the frequency characteristics and integration are improved; ④The integration density is increased; ⑤The equipment volume is reduced, and the high-frequency performance is improved; reliability. The integrated circuit produced by the method is widely used, and is suitable for the fields of equipment miniaturization, high frequency and high reliability.

Description

technical field

[0001] The present invention relates to an integrated circuit, more specifically, to a thick-film hybrid integrated circuit, especially to a surface-mounted thick-film hybrid integrated circuit. Background technique

[0002] In the original hybrid circuit integration technology, on the ceramic substrate, the semiconductor chips and chip components are directly mounted on the thick film substrate, and then the bonding wire (gold wire or silicon aluminum wire) is used to bond the chip and the substrate. Wire bonding, the wire bonding of the substrate and the pins, completes the entire electrical connection, and finally seals the tube base and the tube cap in a specific atmosphere. The main problem existing in the integration technology of the original hybrid circuit is that the internal circuit must be packaged with the tube base and the tube cap. Because the tube base and the tube cap are bulky, the pins are long, and the inner leads connecting the pins are ma...

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