Method for manufacturing high shielding quasi plane transmission line

A fabrication method and quasi-planar technology, applied in electrical components, circuits, waveguide-type devices, etc., can solve the problems of difficult integration, high fabrication cost, radiation effects, etc.

Inactive Publication Date: 2014-04-16
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The manufacturing process of the planar transmission line is simple, the cost is low, and it is easy to integrate with other devices. However, its field structure is semi-open and has radiation effects. EMC work and signal integrity bring challenges, and this phenomenon becomes more and more serious with th

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  • Method for manufacturing high shielding quasi plane transmission line
  • Method for manufacturing high shielding quasi plane transmission line
  • Method for manufacturing high shielding quasi plane transmission line

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Embodiment 1

[0036] Such as figure 2 As shown, the flow process of a manufacturing method of a highly shielded quasi-planar transmission line provided by the present invention, the main steps include:

[0037] Step 101, process the dielectric substrate by laser cutting, and form a through hole at the position of the metal ground layer in advance;

[0038] Step 102, implementing metallization on the surface of the dielectric substrate and in the through holes by vacuum sputtering;

[0039] Step 103, using a photolithography process to form a coplanar waveguide pattern, and electroplating to thicken it;

[0040] Step 104, using a photolithography process to form an insulating dielectric layer above the conduction band;

[0041] Step 105, forming a metallization layer on the dielectric layer by vacuum sputtering;

[0042] Step 106, using a photolithography process to form a metal connection layer above the dielectric layer, and electroplating to thicken it;

[0043] Step 107, use the gri...

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Abstract

The invention provides a method for manufacturing a high shielding quasi plane transmission line. The method includes the steps that firstly, a dielectric substrate is machined, and a through hole is preformed in the position of a metal ground layer; secondly, metallized film layers are formed on the surface of the dielectric substrate and inside the through hole respectively; thirdly, a coplanar waveguide graph is formed and thickened through electroplating, and then an electroplated layer is formed; fourthly, an insulated dielectric layer is formed above a conduction band; fifthly, a metallized film layer is formed above the dielectric layer; sixthly, a metal connecting layer is formed above the dielectric layer and thickened through electroplating, and then an electroplated layer is formed; seventhly, independent graphs are divided into through an abrasion wheel cutting-up method. By the adoption of the scheme, compared with waveguide transmission lines, coaxial line transmission lines and other transmission lines, the high shielding quasi plane transmission line is simpler in the manufacturing process, and can be more easily integrated with generally-used micro-strip lines, coplanar waveguide transmission lines and other plane transmission lines; compared with the micro-strip lines, the coplanar waveguide transmission lines and other plane transmission lines, the high shielding quasi plane transmission line can more effectively solve the problems of signal crosstalk and the like in the plane transmission line working process.

Description

technical field [0001] The invention belongs to the technical field of planar transmission line production, and in particular relates to a production method of a highly shielded quasi-planar transmission line. Background technique [0002] Among various transmission lines involving microwave frequencies, planar transmission lines are widely used because of their open structure and easy integration in microwave integrated circuits. Commonly used planar transmission lines include microstrip lines, suspension lines, slot lines, coplanar waveguides, and coplanar waveguides grounded on the back, such as figure 1 as shown, figure 1 The middle is the most representative microstrip line structure, the middle is a dielectric substrate, the bottom layer is a grounded metal layer, and the upper layer is a metal conduction band, and microwave signals propagate in the upper metal conduction band. Its upper space is open, and the signal will generate radiation during propagation. [00...

Claims

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Application Information

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IPC IPC(8): H01P11/00
Inventor 马子腾刘金现阴磊许延峰
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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