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Halogen-free flame retardant polyamide hot-melt adhesive and preparation method thereof

A technology of polyamide hot melt adhesive and flame retardant polyamide, which is applied in the directions of adhesives, adhesive additives, non-polymer adhesive additives, etc. problem, to achieve the effect of good flame retardant performance and high bond strength

Inactive Publication Date: 2014-04-23
CHANGYUAN ELECTRONICS DONGGUAN +4
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The flame retardancy of materials is a very important performance, which is directly related to the safety of the product. There are many researches on the flame retardancy of polymer materials, but the flame retardancy of polyamide hot melt adhesives is rare, and most of them use halogen flame retardancy. fuel
At present, people's environmental protection requirements for materials are constantly improving. In the latest EU directives, the addition of boric acid substances and red phosphorus has also been restricted. Conventional halogen-containing flame-retardant hot melt adhesives can no longer meet the requirements. Need Develop hot melt adhesive products that meet higher environmental protection requirements

Method used

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Effect test

preparation example Construction

[0026] The preparation method of the above-mentioned halogen-free flame-retardant polyamide hot-melt adhesive comprises the following steps:

[0027] Step 1, raw material weighing: weigh according to the required raw material parts by weight;

[0028] Step 2, compounding of halogen-free flame retardants: Add the required flame retardants into the high-speed mixer and stir evenly;

[0029] Step 3, kneader mixing: add dimer acid type polyamide hot melt adhesive, halogen-free flame retardant, and antioxidant into the kneader, and knead evenly;

[0030] Step 4, twin-screw extrusion granulation: performing secondary mixing on the blend obtained in step 3 through a twin-screw extruder;

[0031] Step 5, cooling and pelletizing: extruding from a twin-screw extruder and pelletizing by a pelletizer to obtain halogen-free flame-retardant polyamide hot-melt adhesive pellets;

[0032] Step 6, drying and packaging: drying the halogen-free flame-retardant polyamide hot-melt adhesive obtain...

preparation Embodiment 1

[0035] Weigh 100 parts of dimer acid type polyamide hot melt adhesive, 15 parts of halogen-free flame retardant and 1 part of antioxidant in parts by weight.

[0036] The halogen-free flame retardant consists of 10 parts of melamine polyphosphate (MPP) and 5 parts of ammonium polyphosphate (APP).

[0037] The antioxidant is composed of 0.5 part of tetrakis [β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester and 0.5 part of distearyl thiodipropionate (DSTDP). .

[0038] The preparation method is as follows:

[0039] Weigh the required raw materials according to the above amount, add the required melamine polyphosphate (MPP), ammonium polyphosphate (APP), etc. into the high-speed mixer, stir for 3 minutes, pour into the kneader, add the weighed dimer Acid-type polyamide hot-melt adhesive and antioxidant, mixed for 10 minutes, the hot-melt adhesive kneaded by the kneader is transferred to the twin-screw extruder extruder for secondary mixing, cooled and dic...

preparation Embodiment 2

[0044] Weigh 100 parts of dimer acid type polyamide hot melt adhesive, 65 parts of halogen-free flame retardant and 0.3 part of antioxidant in parts by weight.

[0045] The halogen-free flame retardant is composed of 30 parts of melamine cyanurate (MCA), 15 parts of melamine polyphosphate (MPP), 15 parts of ammonium polyphosphate (APP), 4 parts of pentaerythritol, and 1 part of zinc oxide.

[0046] The antioxidant is 0.3 parts of tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]pentaerythritol ester.

[0047] The preparation method is as follows:

[0048] Weigh the required raw materials according to the above amount, add the required melamine cyanurate (MCA), melamine polyphosphate (MPP), ammonium polyphosphate (APP), pentaerythritol, zinc oxide, etc. into the high-speed mixer, stir for 3 minutes and pour Put into the kneader, add the weighed polyamide hot melt adhesive and antioxidant, knead for 10 minutes, the hot melt adhesive after the kneader kneading is transfe...

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Abstract

The invention discloses a halogen-free flame retardant polyamide hot-melt adhesive and a preparation method thereof. The halogen-free flame retardant polyamide hot-melt adhesive consists of the following components in parts by weight: 100 parts of a dimer acid polyamide hot-melt adhesive, 15-65 parts of a halogen-free flame retardant and 0.3-3 parts of an antioxidant, wherein the halogen-free flame retardant is one or a compound of the following substances: melamine cyanurate, melamine pyrophosphate, ammonium polyphosphate, pentaerythritol and zinc oxide. The halogen-free flame retardant polyamide hot-melt adhesive is superior in flame retardant property, can pass UL-94V0 grade flame retardancy test, is consistent with the environmental requirements of RoSH and the like, and is high in the bonding strength.

Description

technical field [0001] The invention belongs to the field of hot-melt adhesives, in particular to a halogen-free flame-retardant polyamide hot-melt adhesive and a preparation method thereof. Background technique [0002] PA (Polyamide, polyamide) hot melt adhesive is based on polyamide resin and modified to obtain polyamide hot melt adhesive. Its outstanding advantages are narrow range of softening point, solidification immediately when the temperature is slightly lower than the melting point, good oil resistance and drug resistance; and because the molecule contains polar groups such as amino, carboxyl and amide groups, it is suitable for many polar materials. It has good adhesion, coupled with its excellent oil resistance and solvent resistance, it has a special position in the adhesive industry and is a high-grade adhesive. The high adhesive strength of polyamide, especially its good chemical resistance, makes it widely used in industries such as footwear, clothing, elec...

Claims

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Application Information

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IPC IPC(8): C09J177/00C09J177/08C09J11/04C09J11/06
Inventor 康海杨文磊段金豆刘晓播邱光南
Owner CHANGYUAN ELECTRONICS DONGGUAN