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A kind of cu@sn core-shell structure high-temperature solder and its preparation method

A technology of core-shell structure and high-temperature solder, which is applied in the field of materials, can solve problems such as poor reliability, high cost, and substrate damage, and achieve the effects of simple and controllable process, improved impact resistance, and prevention of crack propagation

Active Publication Date: 2017-02-01
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The melting point of ordinary tin-copper solder is generally lower than 250°C, and the melting point of high-temperature solder formed by adding other components is generally not higher than 300°C, which cannot meet actual needs
Moreover, the use of solder with a higher melting point may damage electronic devices and cause damage to the substrate. Therefore, it has become a common goal of the academic community to make solder for low-temperature welding and high-temperature service.
[0003] Several chip bonding methods that have been used at present all have shortcomings: although the nano-silver sintering method is simple in process and high temperature resistant, and has high electrical conductivity and thermal conductivity, it is obviously costly to use silver as a large-area connection material. It is conducive to large-scale mass production; although the transient liquid phase sintering method only uses copper-tin solder, due to the incomplete interdiffusion, the residual tin will melt at high temperature and cause reliability problems, and the process time is too long; and the thin film Due to the thin weld seam, the connection has the problems of weak impact resistance and poor reliability

Method used

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  • A kind of cu@sn core-shell structure high-temperature solder and its preparation method
  • A kind of cu@sn core-shell structure high-temperature solder and its preparation method
  • A kind of cu@sn core-shell structure high-temperature solder and its preparation method

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Effect test

Embodiment 1C

[0043] The preparation of the metal powder of embodiment 1Cu@Sn core-shell structure

[0044] In the first step, weigh 2g of Cu powder and 2g of PVP and mix them evenly and completely disperse them in 30ml of deionized water;

[0045] In the second step, 0.48g of Sn was weighed and dissolved in 60ml of deionized water, 4.57g of thiourea was weighed and added, and stirred evenly;

[0046] In the third step, the deionized water aqueous solution of the second step is added to the deionized water aqueous solution of the first step under constant stirring, and stirred at room temperature for 10 minutes to ensure complete reaction;

[0047] In the fourth step, the reaction product is repeatedly washed with deionized water or ethanol until the solution is clear and dried in the shade.

Embodiment 2

[0048] Preparation of metal powder of embodiment 2Cu@Sn core-shell structure

[0049] In the first step, weigh 2g of Cu powder and 2g of PVP and mix them evenly and completely disperse them in 30ml of deionized water;

[0050] In the second step, 0.96g of Sn was weighed and dissolved in 60ml of deionized water, 4.57g of thiourea was weighed and added, and stirred evenly;

[0051] In the third step, the deionized water aqueous solution of the second step is added to the deionized water aqueous solution of the first step under constant stirring, and stirred at room temperature for 20 minutes to ensure complete reaction;

[0052] In the fourth step, the reaction product is repeatedly washed with water or absolute ethanol until the solution is clear and dried in the shade.

Embodiment 3

[0053] Preparation of metal powder of embodiment 3Cu@Sn core-shell structure

[0054] In the first step, weigh 2g of Cu powder and 2g of PVP and mix them evenly and completely disperse them in 30ml of deionized water;

[0055] In the second step, 1.92g of Sn was weighed and dissolved in 60ml of deionized water, 9.14g of thiourea was weighed and added, and stirred evenly;

[0056] In the third step, the deionized water aqueous solution of the second step is added to the deionized water aqueous solution of the first step under constant stirring, and stirred at room temperature for 40 minutes to ensure complete reaction;

[0057] In the fourth step, the reaction product is repeatedly washed with water or absolute ethanol until the solution is clear and dried in the shade.

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Abstract

The invention provides a Cu@Sn core-shell structure high-temperature solder and its preparation method. The core-shell structure metal powder has only two elements, Sn and Cu, and has a core-shell structure of Sn-coated Cu particles. The particle size is Between 1 μm and 20 μm. The metal powder is mixed with commercially available flux to obtain solder, which can be used for welding various substrates. During the reflow process, the Sn in the outer layer of the particles can react with the Cu in the inner core to form Cu6Sn5, thereby forming a dispersed distribution in the intermetallic compound. The weld structure of copper particles can be formed above the melting point of Sn, and can serve below the melting point of Cu6Sn5 after formation, so as to achieve the purpose of low temperature connection and high temperature service. The invention has the advantages of simple process, low cost and strong practicability, and solves the problems of high pasting cost, high process temperature and long process time of power device chips at present.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a Cu@Sn core-shell structure high-temperature solder and a preparation method thereof. Background technique [0002] High-temperature power devices are widely used in automotive, underground oil and gas industry, aircraft, space exploration, nuclear reaction environment, and radar. At present, the power device is mainly fixed on the substrate through the chip bonding process. However, due to its high calorific value and high working temperature, which can sometimes reach 350°C, it poses new challenges to the solder used in chip bonding. The melting point of ordinary tin-copper solder is generally lower than 250°C, and the melting point of high-temperature solder formed by adding other components is generally not higher than 300°C, which cannot meet actual needs. Moreover, the use of solder with a higher melting point may damage electronic devices and cause damage ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K1/00
CPCB23K35/0244B23K35/302B23K35/362B22F2301/30B22F2301/10B22F1/17
Inventor 陈宏涛王帅李明雨
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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