The invention provides an IGBT device and a manufacturing method thereof. The IGBT device comprises a substrate, an
oxygen ion defect layer, a collector region and a
hydrogen ion doped region; the substrate comprises a first main surface and a second main surface which are opposite to each other, a front
surface structure of the IGBT device is formed on the first main surface, and the IGBT device comprises an active region, a transition region and a terminal region; the
oxygen ion defect layer is formed in the second main surface of the transition region and the terminal region; the collector region is formed on the second main surface of the substrate; the
hydrogen ion doped region is formed in the second main surface of the substrate, the
oxygen ion defect layer is located in the
hydrogen ion doped region, and
oxygen ions of the oxygen ion defect layer serve as adsorbents of the hydrogen ions, so that the
doping concentration of the hydrogen ions in the
hydrogen ion doped region is increased. When the IGBT device is switched on, the
emission efficiency of the transition region and the terminal region is reduced, and when the IGBT device is switched off, the
electron and hole recombination speed of the transition region and the terminal region is improved, so that the problem of current concentration in the transition region is effectively relieved, and the reliability of an IGBT
chip is improved.