Low-radiation energy-saving glass with multiple functional layers and preparation method of glass
An energy-saving glass and functional layer technology, applied in chemical instruments and methods, glass/slag layered products, layered products, etc., can solve problems such as weather resistance, poor corrosion resistance, high processing and transportation costs, and service life impact. , to achieve the effect of strong corrosion resistance, good mechanical properties and improved weather resistance
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Embodiment 1
[0022] refer to figure 1 Said, a multi-functional low-radiation energy-saving glass, a continuous deposition barrier layer, a titanium functional layer, a silver-titanium functional layer, and a protective layer are sequentially stacked on a coated glass substrate. The barrier layer is used to prevent sodium ions and calcium ions in the glass substrate from entering the functional layer to affect the energy-saving effect. The material of the barrier layer can be silicon oxide or silicon nitride. Silicon oxide or silicon nitride is non-toxic and pollution-free, and is resistant to corrosion and Wear-resistant, the thickness of this layer is 20-35nm; the titanium functional layer is a low emissivity layer, which is used for infrared high reflection design, and the titanium functional layer includes the first titanium oxide film layer 31, the first metal titanium film layer 32, the second titanium oxide film layer Layer 33, sequentially stacked and continuously deposited the ...
Embodiment 2
[0025]The invention discloses a method for preparing multifunctional low-radiation energy-saving glass, which adopts manual or automatic coating, and puts the coating surface of the glass substrate in the direction facing the target material into the substrate frame and sends it into the magnetron sputtering equipment. After the glass substrate is sent into the magnetron sputtering chamber, turn on the mechanical pump to evacuate. According to the production cycle requirements, when the vacuum degree reaches the order of 1Pa, start the transmission system and open the isolation valve between the chamber and the buffer chamber. , the substrate rack enters the buffer chamber, open the vacuum to about 0.1Pa, open the isolation valve, enter the process chamber, turn on the vacuum pump to evacuate to 1.0-4Pa, fill in the working gas argon, process gas oxygen or nitrogen (according to Silicon oxide and silicon nitride are different, for the convenience of the front and rear processes...
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