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Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same

一种有机电子器件、粘合剂膜的技术，应用在薄膜/薄片状的粘合剂、粘合剂类型、电固体器件等方向，能够解决有机发光元件损坏等问题，达到确保机械强度、简单工艺、少单件产品生产时间的效果

Active Publication Date: 2014-07-23
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the above-mentioned composition is coated on the entire surface of an organic light-emitting element, and the organic light-emitting element is assembled and packaged, the organic light-emitting element may be damaged due to radiation of light
In addition, the above method is a liquid method, which has many limitations

Method used

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  • Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same
  • Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same
  • Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Example 1: Formation of Curable Pressure Sensitive Adhesive Films and OEDs

[0087] By polymerizing a press comprising 15 parts by weight of butyl acrylate, 40 parts by weight of methyl ethyl acrylate, 20 parts by weight of isobornyl acrylate, 15 parts by weight of methyl acrylate and 10 parts by weight of hydroxyethyl acrylate Sensitive Adhesive An acrylic polymer having a glass transition temperature of approximately -20°C and a weight average molecular weight of 1,000,000 was prepared.

[0088] With respect to 100 parts by weight of acrylic polymer, by adding 0.2 parts by weight of isocyanate-based cross-linking agent (dicresyl diisocyanate, T-39M), 5 parts by weight of trimethylolpropane type epoxy resin (SR-TMP, SAKAMOTO), 0.25 parts by weight of triaryl sulfonate type cationic photopolymerization initiator (CPI-110A, SAN-APRO Ltd.), and ethyl acetate are used as solvent to prepare coating with 20% solid content cloth solution.

[0089] A 50-μm PET release film c...

Embodiment 2

[0092] All were carried out in the same manner as described in Example 1, except that 10 parts by weight of metal oxide (MgO) was added to the coating solution as a moisture adsorbent with respect to 100 parts by weight of the acrylic polymer. A step of.

Embodiment 3

[0094] All steps were performed as described in Example 1 except that no post-cure (aging process) was used.

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Abstract

The embodiment examples of the present invention relate to a composition for a photocurable adhesive agent comprising an acrylic polymer, an epoxy resin, a cross-linking agent, and a photoinitiator, an organic electronic device comprising a sealing material containing the composition by using an adhesive film, which is a molded product made from a film comprising the composition, and a method for manufacturing the organic electronic device by using the adhesive film. More specifically, the method for manufacturing the organic electronic device comprises the steps of: coupling the adhesive film to an upper substrate; coupling the upper substrate to a lower substrate, which is provided with organic light emitting diodes thereon, so that an adhesive layer covers front surfaces of the light emitting diodes; and photocuring by irradiating light only on the edges of the upper and lower substrates that are coupled, thereby securing mechanical strength by sealing the front surfaces, simplify the manufacturing process by means of photocuring even without directly irradiating light on the light emitting diodes, and enhancing the life of the diodes.

Description

technical field [0001] The present invention relates to an organic electronic device, and more particularly, to a photocurable pressure-sensitive adhesive composition for encapsulating an organic electronic device, an adhesive film formed therefrom and a method for preparing an organic electronic device Methods. Background technique [0002] Organic electronic devices (OEDs) refer to devices including layers of organic materials that use holes and electrons to generate charge exchange, for example, OEDs include photovoltaic devices, rectifiers, transmitters, and organic light emitting diodes (OLEDs). [0003] A representative OED is an OLED, which has lower power consumption and higher response speed, and forms a thinner display device or is lighter than conventional light sources. In addition, the OLED has excellent space utilization and is expected to be used in various fields including all kinds of portable devices, displays, notebook computers, or televisions. [0004]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50C09J7/02C09J133/04C09J11/00
CPCC09J133/08H10K30/88H10K50/846H10K50/841H10K50/8426H10K50/844C08L63/00Y02E10/549C09J133/066C08G59/4028C08G59/68C08L33/066C09J163/00C08F220/14C08F220/1811C08F220/1804C08F220/20B32B37/1207C09J175/16
Inventor 赵允京柳贤智
Owner LG CHEM LTD