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A copper-molybdenum-copper-copper three-layer composite board and its manufacturing method

A composite plate and layer composite technology, applied in chemical instruments and methods, layered products, metal rolling, etc., can solve problems such as not easy delamination, and achieve the effects of low cost, high product qualification rate, and reduced cracking

Active Publication Date: 2016-05-11
长沙升华微电子材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is how to improve the interface bonding strength of the copper-molybdenum-copper-copper three-layer composite plate, so that in the subsequent rolling production process, the interface is not easy to delaminate, and at the same time, the subsequent processing can be reduced. The amount of deformation can reduce the cracking phenomenon of the edge, improve the product qualification rate, and reduce the cost

Method used

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  • A copper-molybdenum-copper-copper three-layer composite board and its manufacturing method
  • A copper-molybdenum-copper-copper three-layer composite board and its manufacturing method

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preparation example Construction

[0023] The preparation method of the copper-molybdenum-copper-copper three-layer composite board comprises the following steps:

[0024] Step 1: Electroplating the molybdenum-copper alloy plate with pure copper with a thickness of 2-5 microns in advance to obtain a copper-plated molybdenum-copper alloy plate 5;

[0025] Step 2: Cover both sides of the copper-plated molybdenum-copper alloy plate 5 with a copper plate 4 10% larger than the area, and place them together on the lower die 3 in the hot-press sintering furnace 1;

[0026] Step 3: Start the hot-pressing sintering furnace 1, press the upper die 2 downward, and press it tightly on the copper plate 4 to form a pressure of 10-25Mpa, then start to heat up from room temperature to 800-1000°C, and pass through the atmosphere protection. After heat preservation and pressure holding for 0.5-4 hours, keep the pressure constant and cool in the furnace to obtain a copper-molybdenum-copper-copper three-layer composite ingot;

[0...

Embodiment 1

[0030] Embodiment 1, with reference to figure 1 , the manufacture of copper-molybdenum-copper-copper three-layer composite board, the size of copper-plated molybdenum-copper alloy plate 5 is (100×80×15) mm, the size of copper plate 4 is (120×100×17.5) mm, and the copper plate is sandwiched by molybdenum The copper plywood is placed in the center of the lower die 3, and the hot-press sintering furnace 1 is started, so that the upper die 2 is pressed down on the copper plate 4 to form a pressure of 15Mpa, and then heated to 850°C under the protection of a hydrogen atmosphere. Press for 30 minutes, then keep the pressure constant as the furnace cools. After cooling, the composite ingot is taken out, the middle layer is molybdenum-copper alloy, and the two sides are covered with a 17.5 mm thick copper layer.

[0031] The composite ingot was heated to 800°C under atmosphere protection, kept at a temperature of 20 minutes, taken out, and hot rolled to a thickness of 2 mm through 5 ...

Embodiment 2

[0032] Embodiment 2: the manufacture of copper-molybdenum copper-copper three-layer composite plate, the size of copper-plated molybdenum-copper alloy plate 5 is (80 * 50 * 20) millimeter, and the size of copper plate 4 is (100 * 60 * 20) millimeter, copper plate 4 Clamp the molybdenum-copper plywood and place it in the center of the lower die 3, start the hot-press sintering furnace 1, press the upper die 2 down on the copper plate to form a pressure of 20Mpa, and then heat it to 900°C in a vacuum environment, The vacuum degree is 10-4 Torr, heat preservation and pressure holding for 3 hours, then keep the pressure constant and cool down with the furnace. After cooling, the compounded ingot is taken out, the middle layer is molybdenum-copper alloy, and the two sides are covered with a 20 mm thick copper layer.

[0033] The composite ingot was heated to 850° C. in a mixed atmosphere of hydrogen and nitrogen (hydrogen volume: nitrogen volume = 3:1), kept for 30 minutes, and hot...

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Abstract

The invention relates to a copper, molybdenum-copper and copper three-layer composite plate and a manufacturing method thereof. A layer of electroplated copper serving as a transitional layer is arranged on an interface of each of a copper plate (4) and a molybdenum-copper alloy plate; by the adoption of a high-temperature hot-pressing sintering technology, the interface bonding strength is high; in a subsequent rolling production process, the interfaces are difficultly layered; meanwhile, the subsequent processing deformation can be reduced; the phenomenon of cracking of an edge part is reduced; therefore a copper / molybdenum-copper / copper electronic encapsulation material provided by the invention is high in interface bonding strength, high in product qualification rate and low in cost, and can be widely applied to the electronic industry.

Description

technical field [0001] The invention relates to the field of electronic functional composite materials, in particular to a copper-molybdenum copper-copper three-layer composite board and a manufacturing method thereof. Background technique [0002] Copper has high thermal and electrical conductivity and is easy to process and form, so it has been widely used in the electronics industry. However, copper is soft and has a large thermal expansion coefficient, which limits its further application. The refractory metal molybdenum has the characteristics of high strength, small thermal expansion coefficient, and large elastic modulus. Therefore, combining copper and molybdenum copper and giving full play to their respective advantages can obtain special properties that a single metal cannot have, such as a designable thermal expansion coefficient and good electrical and thermal conductivity. [0003] European patent literature (EP1553627A1) describes a manufacturing method of a c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21B1/38B32B15/01
Inventor 姜国圣周俊吴化波
Owner 长沙升华微电子材料有限公司