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A particle-added low-silver-based lead-free solder

A lead-free solder and lead-free solder technology, applied in the field of Co nano hollow sphere particle reinforced low silver lead-free solder and nano particle reinforced lead-free solder, can solve the problem of poor wettability, decreased joint life, welding Problems such as reduced reliability of joints

Inactive Publication Date: 2016-05-25
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[6] The current low-silver lead-free solders are all developed on the basis of Sn-Ag-Cu solders. Although SAC0307 and SAC105 can be applied, the reduction of silver content has many adverse effects on the performance of solders. Solder melting point Increased, poor wettability, reduced reliability of welded joints, reduced joint life due to too thick IMC at the welded interface, etc.

Method used

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  • A particle-added low-silver-based lead-free solder
  • A particle-added low-silver-based lead-free solder
  • A particle-added low-silver-based lead-free solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 1. Preparation of Co nano hollow spheres

[0022] (1) Iron core preparation:

[0023] a. Take 69.5g FeSO 4 ·7H 2 O, with 0.5mol / L solution 500mL;

[0024] b. Add 50mL deionized water to 150mL ammonia water for later use, weigh 4.5gNaBH 4 Add the above standby ammonia water;

[0025] c. Under mechanical stirring, the above two are mixed and heated to 80°C. After about 15 minutes, there is a bright silver mirror on the cup wall, the bubbles disappear, the reaction is over, and the iron core is formed.

[0026] (2) Coated Co:

[0027] a. Take 21g CoSO 4 and potassium sodium tartrate, 10gNaOH, respectively take a certain amount of distilled water to dissolve, and then mix to form a solution with a complexation ratio of 1:1 with a pH>13, use a volumetric flask to make up 1L, and take 500mL;

[0028] b. Take the iron core of the above step and add 500mL of plating solution, take 10mL of hydrazine hydrate and dilute to 40mL, gradually add to start the reaction, stir ult...

Embodiment 2

[0042] The low-silver-based lead-free solder added to the Co nano-hollow sphere particles in this embodiment is composed of low-silver-based tin-based solder and Co nano-hollow sphere particles, wherein the diameter of the Co nano-hollow sphere particles is about 600 nm. The lead-free solder composition is:

[0043]

[0044] The prepared solder of this composition was tested for wetting force, DSC test, and observation of intermetallic compounds at the interface. The results are as follows: figure 2 , 3 , 4, and 6 show that all kinds of performance have been significantly improved.

[0045] [1] Shangguan Dongkai. Environmental protection strategy guides the electronics manufacturing industry to go lead-free [A]. See: Proceedings of the 14th Shanghai International SMT Technology Advanced Symposium [C], Shanghai, 2004, 14-22

[0046] [2] Roadmap IPC. A guide for assembly of lead-free electronics [J]. Draft IV, June, 2000.

[0047][3] ZhangL, HeC, GuoY, et al.Developmentof...

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Abstract

The invention relates to low-silver lead-free solder with Co nanometer hollow ball particles. The low-silver lead-free solder with Co nanometer hollow ball particles is used for electronic component welding, surface mounting and other soldering techniques, uses low-silver tin-based lead-free solder as basal body, and is added with a little of nanometer Co particles. The low-silver lead-free solder is composed of 0.3-1.3% of Ag, 0.05-1% of Co nanometer hollow ball particles and rest of Sn by weight. Compared with the ordinary lead-free solder, the melting point is lowered, the wetting power is improved, the wetting time is shortened, the inferior intermetallic component Cu3Sn thickness is lowered, and the welding performance is more excellent.

Description

technical field [0001] The invention relates to a lead-free solder for soft soldering and surface packaging of electronic components, in particular to a low-silver-based lead-free solder reinforced by Co nano hollow sphere particles, that is, adding Co nano hollow sphere particles into low-silver lead-free solder It is a tin-based lead-free solder that forms a nano-particle reinforced lead-free solder. Background technique [0002] In the electronic connection industry, tin-lead solder as a connection material has long dominated [1]. However, the long-term use of lead in human society has found that lead will pose a serious threat to human health. Moreover, lead-containing waste pollutes the atmosphere, soil and even groundwater due to improper treatment, which destroys the ecological environment; at the same time, the ecological environment acts on humans in turn, making people suffer from the air they breathe, drinking water and daily food. Excessive intake of harmful su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCH01L2924/3651
Inventor 赵修臣张雪超
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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