High thermal conductivity of graphite material and preparation method and application thereof

Abstract

The invention relates to a high thermal conductivity graphite material, and a preparation method and application thereof. The high thermal conductivity graphite material uses graphite tailing and ceramic components generated in the machining processes of mesocarbon microbeads and lithium ion battery anode material as the main raw materials; and the raw materials are subjected to cold compression molding and graphitization to obtain the high thermal conductivity graphite material. The graphite material provided by the invention has excellent performance, is particularly suitable as a radiating fin base material for civil high-end electronic devices, LED chip materials and heat exchangers for industrial devices. In addition, the process provided by the invention is simple and has short material preparation period, and the size of the prepared material can be enlarged; therefore, the method is easy for mass production, and greatly reduces the cost of production materials. The method also solves the problems and hidden dangers of stacking landfill and environmental pollution caused by graphite tailing, realizes the comprehensive utilization of waste resources, and decreases the comprehensive cost for the manufacturers of composite cathode material of lithium ion battery by more than 10%.

Description

technical field

[0001] The invention relates to the field of carbon materials, in particular to a high thermal conductivity graphite material and its preparation method and application. Background technique

[0002] High-power density electronic devices and high-end electronic industrial devices are gradually developing toward miniaturization, compact structure, and high power density, which leads to heat dissipation problems and poses severe challenges to the stability and reliability of electronic components. Therefore, the problem of heat dissipation has become a bottleneck in the miniaturization and integration of electronic products. In order to dissipate the heat generated during the operation of electronic components as quickly as possible, it is becoming more and more important to develop materials with better thermal conductivity. At present, the heat sink substrates used in general heat dissipation materials (such as civil high-end electronic devices, chip materia...

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