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Ductile mode machining methods for hard and brittle components of plasma processing apparatuses

A plasma and processing device technology, applied in the field of single-point turning, can solve problems such as product scrapping and product quality degradation

Active Publication Date: 2014-08-20
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The latter can lead to a greatly and significantly reduced product quality or product scrapping

Method used

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  • Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
  • Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
  • Ductile mode machining methods for hard and brittle components of plasma processing apparatuses

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Embodiment Construction

[0010] Disclosed herein is a method of ductile mode machining of a component of a plasma processing apparatus, wherein the component is made of a non-metallic hard and brittle material. As used herein, "non-metallic hard and brittle material" means ceramic, silicon-containing (single or polycrystalline silicon-containing) and / or quartz materials, and more specifically, including quartz, suitable for use as a component of a semiconductor processing chamber , silicon, silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, boron carbide, yttrium oxide, zirconia, diamond, sapphire, glass, etc. Under normal conditions, semiconductor and ceramic materials are hard and brittle, and are not prone to plastic deformation.

[0011] In order to achieve plastic deformation (ie, ductile mode) of these hard and brittle materials, a portion of the surface of the component preferably undergoes a high pressure phase transformation. These embodiments of ductile mode machining metho...

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Abstract

A method of ductile mode machining a component of a plasma processing apparatus wherein the component is made of nonmetallic hard and brittle material wherein the method comprises single point turning the component with a diamond cutting tool causing a portion of the nonmetallic hard and brittle material to undergo a high pressure phase transformation to form a ductile phase portion of the hard and brittle material during chip formation wherein a turned surface is formed from a phase changed material and the turned surface is a grooved textured surface of phase changed material.

Description

technical field [0001] The present invention relates to machining components of plasma processing devices, and more particularly, to single point turning of components for plasma processing devices formed of non-metallic hard and brittle materials. Background technique [0002] In the field of semiconductor material processing, for example, semiconductor material processing apparatuses including vacuum processing chambers are used to effect various processes, such as etching and deposition of various materials and debonding on substrates. As semiconductor technology evolves, reducing the size of transistors requires wafer processing and process equipment with increasing accuracy, repeatability, and cleanliness. A variety of equipment exists for semiconductor processing, including applications involving the use of plasma, such as plasma etching, reactive ion etching, plasma enhanced chemical vapor deposition (PECVD), and debonding. The types of equipment required for these p...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B1/00
CPCB23P6/00H01J37/32467H01L21/3065C23C16/4404B23B27/20B23B5/00B23P25/006C23C14/564B23B2226/18B23B1/00B28D1/16B23K26/0006B23K2103/56Y10T82/10Y10T29/4973
Inventor 约翰·F·斯顿夫蒂莫西·戴尔大卫·艾伦·鲁伯格利华·L·黄
Owner LAM RES CORP