Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate

Abstract

The invention discloses a making method for a high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate. The method comprises the steps of: preparation of a veneer layer glue solution and an inner material layer glue solution respectively, cementing, superimposition, and hot pressing. The veneer layer glue solution comprises the ingredients of: modified epoxy resin, tetrafunctional epoxy resin, an amine curing agent, an imidazole curing accelerator, a silane coupling agent KH560, an efficient flame retardant and a veneer layer filler; and any one of or a composition of over one of acetone, butanone, and dimethylformamide is taken as the solvent for preparation. The inner material layer glue solution comprises the ingredients of: low bromine epoxy resin, an amine curing agent, an imidazole curing accelerator, a silane coupling agent KH560, and an inner material layer filler; and any one of or a composition of over one of acetone, butanone, and dimethylformamide is taken as the solvent for preparation. The copper-clad plate prepared by the method provided by the invention has a CTI value of greater than or equal to 600V, efficient heat-conducting property, and thermal conductivity of greater than or equal to 1.7W / mk, thus meeting the use requirements of LED products for higher security. At the same time, the copper-clad plate also has excellent heat resistance.

Description

technical field [0001] The invention relates to the field of copper-clad laminates, in particular to a method for manufacturing an FR-4 copper-clad laminate with high thermal conductivity, high heat resistance and high CTI for LEDs. Background technique [0002] LED (Semiconductor Diode Light Emitting Tube) is called the fourth-generation light source technology, which has the characteristics of energy saving, environmental protection, long life, low power consumption, high brightness, etc., and has been widely used in various indications, displays, decorations, lighting and other fields , especially the LED lighting market has been considered the most important and most developed application of LED. As a new generation of high-brightness solid cold light source, LED is suitable for long-term lighting in various places closely related to people; with the continuous development of LED technology and the vigorous promotion of applications, its luminous efficiency and greatly i...

AI Technical Summary

Problems solved by technology

[0006] In addition, at present, in terms of LED substrates, CEM-3 composite substrates are generally used as substrate materials. Generally, the glass transition temperature, dip soldering resistance, insulation resistance, and electrical properties of ordinary CEM-3 copper clad laminates can reach FR- 4 CCL standards, the difference is that the dimensional stability, bending strength, and moisture resistance of CEM-3 materials are lower than FR-4 CCL, and the thermal expansion coefficient is higher than FR-4 CCL, which affects PCB processability and processing The stability of the final product quality, etc., and the dimensional stability is related to the accuracy of circuit board processing and component assembly. The board with too large thermal expansion coefficient has poor reliability of the through hole. This board is used in PCB hot air leveling or wave soldering. When it expands and contracts violently, it is easy to break through holes and form an open circuit; some LED products have been in outdoor working conditions for a long time, such as poor moisture resistance, and are prone to delamination and other phenomena when used in harsh environments for a long time, which will affect LED products. service life, etc.

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