Production method of halogen-free Tg130 copper-clad plate

A manufacturing method and technology of copper clad laminates, which are applied in the field of copper clad laminates to achieve the effect of small smoke generation and excellent heat resistance

Active Publication Date: 2014-09-03
金宝电子(铜陵)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of heat resistance and combustibility of copper clad laminates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for manufacturing a halogen-free Tg130 copper clad laminate, the steps are as follows:

[0022] a. Add 900 parts of phosphorus-based flame retardant halogen-free epoxy resin A, 12 parts of tetraphenol-based ethylene epoxy resin B, 0.6 parts of accelerator solution and 65 parts of bisphenol A novolac epoxy resin C, respectively High-shear kettle, turn on the stirring paddle of the high-shear kettle, adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and stir for 0.5 hours;

[0023] b. Then adjust the dispersion motor to 35HZ, the emulsification motor to 35HZ, stir for 2 hours, and take samples to test the glue index;

[0024] After the glue solution in steps c and b is qualified, add 2.8 parts of coupling agent, 45 parts of aluminum hydroxide, 175 parts of soft silicon, 60 parts of talcum powder, 21 parts of curing agent and 400 parts of solvent, and start the high-shear kettle. Adjust the dispersion motor to 40HZ, the emulsification motor t...

Embodiment 2

[0031] A method for manufacturing a halogen-free Tg130 copper clad laminate, the steps are as follows:

[0032] a. Add 1000 parts of phosphorus-based flame retardant halogen-free epoxy resin A, 14 parts of tetraphenol-based ethylene epoxy resin B, 0.7 parts of accelerator solution and 70 parts of bisphenol A novolac epoxy resin C, respectively High-shear kettle, turn on the stirring paddle of the high-shear kettle, adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and stir for 0.5 hours;

[0033] b. Then adjust the dispersion motor to 35HZ, the emulsification motor to 35HZ, stir for 2 hours, and take samples to test the glue index;

[0034] After the glue solution in steps c and b is qualified, add 3 parts of coupling agent, 50 parts of aluminum hydroxide, 200 parts of soft silicon, 70 parts of talcum powder, 24 parts of curing agent and 416 parts of solvent, and start the high-shear kettle. Adjust the dispersion motor to 40HZ, the emulsification motor to...

Embodiment 3

[0041] A method for manufacturing a halogen-free Tg130 copper clad laminate, the steps are as follows:

[0042] a. Add 1100 parts of phosphorus-based flame retardant halogen-free epoxy resin A, 14.5 parts of tetraphenol-based ethylene epoxy resin B, 0.78 parts of accelerator solution and 74 parts of bisphenol A novolac epoxy resin C, respectively High-shear kettle, turn on the stirring paddle of the high-shear kettle, adjust the dispersion motor to 40HZ, the emulsification motor to 40HZ, and stir for 0.5 hours;

[0043] b. Then adjust the dispersion motor to 35HZ, the emulsification motor to 35HZ, stir for 2 hours, and take samples to test the glue index;

[0044] After the glue solution in steps c and b is qualified, add 4.6 parts of coupling agent, 55 parts of aluminum hydroxide, 210 parts of soft silicon, 78 parts of talcum powder, 25 parts of curing agent and 420 parts of solvent, and start the high-shear kettle. Adjust the dispersion motor to 40HZ, the emulsification mot...

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PUM

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Abstract

The invention discloses a production method of a halogen-free Tg130 copper-clad plate. The method includes preparing a glue solution, coating the glue solution on a glass cloth, drying, stacking and pressing. The halogen-free Tg130 sheet use produced by the invention has the total halogen content less than 900 ppm. The copper-clad plate meets the EU non-halogenation requirements and has the following sheet properties: glass transition temperature of Tg135-145 higher than a general Tg130 series sheet in the market, excellent heat resistance reaching 80S-110S (according to IPC-TM-650-2.4.8 standard detection), which is increased by about 20S compared with the heat resistance of a routine halogen-free Tg130, combustion of V-0 level (according to America UL-94 standard detection), and small smoke amount in combustion.

Description

technical field [0001] The invention relates to the technical field of copper clad laminates used in printed circuit boards, in particular to a method for manufacturing a halogen-free Tg130 copper clad laminate. Background technique [0002] At present, according to the latest EU halogen-free requirements for electronic products, IEC, JPCA, and IPC jointly agree on various industry standards. The acceptable halogen content is: bromine is 900ppm, chlorine is 900ppm, and the total halogen content is at most 1500ppm. The main resin of ordinary FR-4 copper clad laminate is a brominated epoxy resin based on tetrabromobisphenol A, in which tetrabromobisphenol A is used as a flame retardant for glass fiber reinforced copper clad laminate, so that the copper clad laminate has good flame retardancy , but the halogen content of the copper clad laminate mainly based on brominated epoxy resin is much greater than 100000ppm. At present, the halogen content of halogen-free resins on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B15/092B32B15/20B32B27/04B32B27/18C08L63/00C08L63/04C08K3/22C08K3/34C08K3/36
Inventor 凌云钱笑雄
Owner 金宝电子(铜陵)有限公司
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