Low-temperature sintering ceramic medium material

Abstract

The invention discloses a low-temperature sintering ceramic medium material. The low-temperature sintering ceramic medium material is characterized by comprising, by weight, 31-47 parts of pottery stone, 11-17.9 parts of sodium carbonate, 10-25 parts of polyving akohol, 5.7-13.6 parts of silicon dioxide, 12-34 parts of sericite, 11-54 parts of synthetic rubber, 1-11 parts of acetyl acetone cerium, 4-9 parts of polycarbosilane, 3-15 parts of manganese dioxide, 5.7-18.4 parts of hydrophobic modification nanoscale silicon oxide and 3-14 parts of butyl rubber. The low-temperature sintering ceramic medium material is low in sintering temperature, high in dielectric constant, low in dielectric loss, wide in sintering shrinkage percentage range, and capable of being co-fired with a high-conductivity silver inner electrode .

Description

technical field [0001] The invention relates to a low-temperature sintered ceramic dielectric material. Background technique [0002] MLCC has the characteristics of small size, large capacitance, low loss rate when used at high frequency, suitable for mass production, low price and high stability. It is becoming more and more popular in information products that emphasize light, thin, short, small and surface mount technology (SMT) Under the trend, it has a good development prospect. The advantages of MLCC are high voltage and high heat resistance, wide operating temperature range, miniaturization and chip type, and are mainly used in motherboards, notebook computers, mobile phones, liquid crystal displays, TVs, CD players, automobiles and other fields. At present, MLCC has become the largest and fastest-growing chip component in the world. [0003] The military and aerospace fields have always been the main battlefield for advanced countries to demonstrate their strength...

AI Technical Summary

Problems solved by technology

[0005] At present, there are many X8R ceramic materials reported, such as BaTiO3 series, BiScO3 series, and Bi0.5Na0.5TiO3 series, etc. Dielectric ceramic materials, but these ceramic materials have problems such as high sintering temperature, low dielectric constant and high loss.