Annular diamond double-blade band saw and manufacturing method thereof

Abstract

The invention discloses an annular diamond double-blade band saw and a manufacturing method thereof. Diamond particles are uniformly solidified on an electroplated layer by electroplating electrodeposited metal layers coating the two side edges of a stainless steel belt, and a diamond composite coating constructed by the electrodeposited metal layers and the diamond particles is applied to chip machining. The band saw disclosed by the invention can be made into different widths and different lengths, and diamond particles of different particle sizes can be used as required; the band saw can be arranged on different types of equipment, and is mainly applied to high-speed one-way band saw machining and linear cutting; the two edges of the stainless steel belt are provided with the diamond composite coatings, so that the service life of a diamond tool is prolonged, and the utilization ratio is increased; the band saw can be used for cutting hard and crisp materials into slices, and a certain round face can be machined according to the width of the band saw; meanwhile, the band saw has trimming and edge grinding capability, and has a very wide application prospect.

Description

(1) Technical field: [0001] The invention relates to a diamond cutting tool, in particular to an annular diamond double-edged band saw and a manufacturing method thereof. (two) background technology: [0002] At present, the existing tools for cutting hard and brittle materials (such as: sapphire, monocrystalline silicon rods, gallium arsenide crystals, gemstones, etc.) are mainly internal circular cutting machines and external circular cutting machines using diamond saw blades, etc. , its common feature is that the blades used for cutting are all single-sided blades. When the blade fails, the tool will fail, which greatly reduces the service life of the tool and the utilization rate of the substrate; at the same time, due to size restrictions, it is difficult to use this diamond saw blade to cut and make sheets. , the power is low; when the saw blade is thicker, the incision is larger when cutting precious materials, the material loss is large, and the efficiency is low. ...

AI Technical Summary

Problems solved by technology

[0004] During the wire saw cutting process, the abrasive and the wire saw are separated, so the cutting effect is low. At the same time, the abrasive particles move during the cutting process, and the cuts cut on the workpiece are also relatively large. Generally, the cut is about 1mm. The thickness of each part of the sheet is quite different, the warpage is serious, and the traces left on the surface of the sheet are deep. In order to make the sheet meet the use requirements, it is necessary to perform subsequent grinding and other processing, which increases the processing cost. And the production cycle, and it is easy to cause poor quality of the sliced ​​materials; in addition, due to the small diameter of

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