Composite copper electrode ceramic positive temperature coefficient thermistor and its preparation process

Abstract

The invention relates to a composite copper electrode ceramic positive temperature coefficient thermistor and a preparation process thereof. The composite copper electrode ceramic positive temperature coefficient thermistor comprises a ceramic body, an electrode layer arranged on the ceramic body, a protective layer outside the ceramic body and pins at the lower end of the protective layer, wherein the electrode layer is a composite electrode layer and is composed of a bottom electrode layer and an outer electrode layer; the bottom electrode layer is a Cr layer formed by sputtering coating, the outer electrode layer is a Cu layer formed by sputtering coating; the bottom electrode layer is combined with the surface of the ceramic body, and the outer electrode layer is stacked on the bottom electrode layer to form the composite copper electrode layer. According to the invention, the composite copper electrode layer material is formed on the ceramic body by sputtering coating which replaces a traditional precious metal electrode infiltration sintering process, so that the electrode material cost is greatly reduced, and the electrode preparation time is shortened; the condition that the tension force between the electrode and the ceramic body in preparation by sputtering coating is low can be improved; and meanwhile, the problem that the copper electrode can be oxidized when prepared at high temperature can be solved, the pollution is reduced, and the environment protecting process is realized.

Description

technical field [0001] The invention relates to a thermistor, in particular to a composite copper electrode ceramic positive temperature coefficient thermistor and a preparation process thereof. Background technique [0002] The ceramic positive temperature coefficient thermistor is a functional ceramic material developed by applying its characteristics to the barium titanate base material. Based on the phenomenon, various component applications (overcurrent protection, temperature sensor, constant temperature heater, etc.) have been developed, and its basic structure mainly consists of ceramic body structure, electrode layer, lead structure and protective layer. Because the product has the characteristics of simple structure, small size and high stability, it is widely used in today's electronic circuit protection design and temperature sensing components. [0003] The traditional CPTCR electrode preparation method is mostly the infiltration process of silver paste coating...

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Problems solved by technology

[0003] The traditional CPTCR electrode preparation method is mostly the infiltration process of silver paste coating. Although it can meet the above CPTCR electrode preparation, its disadvantages are as follows: 1. The silver infiltration process is lengthy and labor-intensive; 2. Silver The preparation of slurry contains harmful substances, and there are concerns about pollution to the human environment; 3. The cost of silver electrodes is expensive, and it is impossible to provide cost-effective products for electronic industry applications

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